Solid-state imaging device, method of manufacturing the same, and electronic apparatus

ABSTRACT

A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. patent application Ser. No.12/699,488, filed Feb. 3, 2010, which claims priority to Japanese PatentApplication Nos. JP 2009-028822 and JP 2009-148088, filed in the JapanPatent Office on Feb. 10, 2009 and Jun. 22, 2009, respectively, theentire disclosures of which are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a solid-state imaging device, a method ofmanufacturing the same, and an electronic apparatus such as a cameraincluding the solid-state imaging device.

2. Description of the Related Art

A digital video camera or digital still camera which is for use byconsumers has called for high resolution power to transmit details of aphotographic subject and a reduced-size device with a regard toportability. In addition, in order to realize these demands, developmenton a reduction in the pixel size while maintaining the image capturingproperty has been performed in regard to a solid-state imaging device(image sensor). However, in recent years, in addition to existingdemands for high resolution and reduction in size, demand has beenincreasing for improvement in low luminance for photographic subjects orhigh-speed image capturing and the like. In order to realize these,expectation has increased for improvement in comprehensive image qualitystarting from the SN ratio in the solid-state imaging device.

The CMOS solid-state imaging device is categorized into afront-illuminated device shown in FIG. 5 and a back-illuminated deviceshown in FIG. 6. The front-illuminated solid-state imaging device 111includes a pixel region 113 where a plurality of unit pixels 116composed of photodiode PDs, which become a photoelectric conversionsection, and a plurality of pixel transistors, are formed in pluralnumber on a semiconductor substrate 112, as shown in the schematicconfiguration diagram of FIG. 5. The pixel transistor (not shown)represents a gate electrode 114 in FIG. 5, representing schematicallythe presence of the pixel transistor. Each of the photodiodes PD isisolated by an element isolation region 115 formed of an impuritydiffused layer. A multilayer of interconnection layers 119, in which aplurality of interconnections 118 is disposed through an interlayerinsulating film 117, is formed on the surface side of a semiconductorsubstrate 112 where the pixel transistor is formed. The interconnection118 is formed in other parts than those corresponding to the position ofthe photodiode PD. On the multilayer of the interconnection layers 119,an on-chip color filter 121 and an on-chip microlens 122 are formed inthis order through a planarization film 120. The on-chip color filter121 is constituted by arranging each color filter of, for example, red(R), green (G) and blue (B). In the front-illuminated solid-stateimaging device 111, the light L is incident from the side of thesubstrate surface, on which the multilayer of the interconnection layers119 is formed, using this substrate surface as a light receiving surface123.

A back-illuminated type solid-state imaging device 131 includes thepixel region 113 where a plurality of unit pixels 116 composed of thephotodiodes PD, which become a photoelectric conversion section, and aplurality of pixels transistors are formed in plural number on thesemiconductor substrate 112, as shown in the schematic configurationdiagram of FIG. 6. The pixel transistor (not shown) is formed on thesurface side of the substrate, and represents a gate electrode 114 inFIG. 6, representing schematically the presence of the pixel transistor.Each of the photodiodes PD is isolated by the element isolation region115 formed of an impurity diffused layer. The multilayer of theinterconnection layers 119, in which a plurality of interconnections 118is disposed through the interlayer insulating film 117, is formed on thesurface side of the semiconductor substrate 112 where the pixeltransistor is formed. In the back-illuminated device, theinterconnection 118 can be formed regardless of the position of thephotodiode PD. On the other hand, an insulating layer 128, the on-chipcolor filter 121 and the on-chip microlens 122 are formed in this orderon the backside of the semiconductor substrate 112 to which thephotodiode PD faces. In the back-illuminated solid-state imaging device131, the light L is incident from the substrate backside, which is theside opposite to the substrate surface on which the multilayer of theinterconnection layers 119 and the pixel transistor are formed, usingthis substrate backside as a light receiving surface 132. Since thelight L is incident to the photodiode PD with no restriction of themultilayer of the interconnection layers 119, apertures of thephotodiode PD can be broadly taken, and high sensitivity can beachieved.

The present applicants have succeeded in the development of experimentalproduction of a back-illuminated CMOS solid-state imaging device thatimproves sensitivity, which is one of the main elements for high imagequality and noise reduction rate by changing the basic structure ofpixels to the back-illuminated type without losing the advantages of lowpower consumption and high speed that the CMOS solid-state imagingdevice has. This developed back-illuminated CMOS solid-state imagingdevice has 5 million effective pixels, each pixel size being 1.75μm×1.75 μm, and is driven at a rate of 60 frames per second.

In the front-illuminated device of a related art, the interconnection118 or the pixel transistor on the surface side of a substrate, wherethe photodiodes PD are formed, hinders the incident light collected withan on-chip microlens, which is an issue in reduction of pixel size andvariation of incident angle. In comparison to this, in theback-illuminated device, applying the light from the backside invertedfrom the silicon substrate allows an increase in the amount of the lightincident to unit pixels while also suppress sensitivity reduction inregard to angle variation of incident light with no influence of theinterconnection 118 or the pixel transistor.

The back-illuminated CMOS solid-state imaging device is disclosed, forexample, in Japanese Unexamined Patent Application Publication Nos.2003-31785, 2005-353631, 2005-353955, and 2005-347707. In addition, atechnique of using hafnium oxide (HfO₂) as an antireflection film usedin the back-illuminated CMOS solid-state imaging device is disclosed inJapanese Unexamined Patent Application Publication No. 2007-258684.

Solid-state imaging devices are largely divided into a CCD (ChargeCoupled Device) type solid-state imaging device and a CMOS(Complementary Metal Oxide Semiconductor) type solid-state imagingdevice.

In these solid-state imaging devices, the light-receiving portioncomposed of photodiodes is formed for each pixel. In the light-receivingportion, signal charges are generated by photoelectric conversion byincident light to the light-receiving portion. In the CCD typesolid-state imaging device, signal charges generated in thelight-receiving portion are transferred to a charge transfer portionthat has the CCD structure and output in the output portion as convertedto pixel signals. On the other hand, in the CMOS type solid-stateimaging device, signal charges generated in the light-receiving portionare amplified for each pixel and the amplified signals are output aspixel signals by signal ray.

In such solid-state imaging device, there are problems that aliasing isgenerated in a semiconductor substrate by tilted incident light orincident light diffusely reflected in the upper portion of thelight-receiving portion, and optical noise such as smear, flare isgenerated.

Japanese Unexamined Patent Application Publication No. 2004-140152mentioned below describes the constitution of the CCD type solid-stateimaging device that allows the suppression of smear generation byforming a light-shielding film, which is formed in the upper portion ofthe charge transfer portion, to be buried in the groove portion that isformed in the interface between the light-receiving portion and the readgate portion. Since the CCD type solid-state imaging device in JapaneseUnexamined Patent Application Publication No. 2004-140152 is constitutedto form the light-shielding film in the groove portion formed using theLOCOS oxide film, it is difficult to form the light-shielding film deepin the substrate, and not possible to completely prevent incidence oftilted light, which is a cause of smear. In addition, since the pixelarea is reduced in proportion to the burying depth of thelight-shielding film, it is practically difficult to bury deep thelight-shielding film.

In recent years, a back-illuminated solid-state imaging device has beenproposed, in which the light is applied from the side opposite to theside of the substrate on which the interconnection layer is formed (seeJapanese Unexamined Patent Application Publication No. 2004-71931described below). In the back-illuminated solid-state imaging device,the light application side does not include the interconnection layer,the circuit element and the like, and thereby the aperture rate of thelight-receiving portion formed on the substrate can be enhanced.Furthermore, since the incident light is incident to the light-receivingportion with no reflecting to the interconnection layer and the like,sensitivity is improved.

Even in such a back-illuminated solid-state imaging device, there is aconcern about optical noise due to tilted light, and thus alight-shielding film is preferably formed between the light-receivingportions of the backside of the substrate, which becomes the lightapplication side. In this case, a layer, that has the light-shieldingfilm on the backside of the substrate that becomes the light applicationside, may be considered to be formed as one layer. However, the distancebetween the substrate and the on-chip lens side is lengthened inproportion to the height of the light-shielding film, and thusdeterioration of light-collecting property may occur. When thelight-collecting property is deteriorated, problems may occur such thatthe tilted light transmitted through a color filter of other pixels isincident to the light-receiving portion of different pixels from thepixels, and color mixing and sensitivity reduction are also generated.

Meanwhile, it has been found that in the back-illuminated CMOSsolid-state imaging device, the light-collecting structure made of onlythe on-chip microlens 122 has following problems remarkably that mayhappen.

(1) It is very difficult to completely suppress optical color mixingwith adjacent pixel. It may not be a problem in use such as monitoring,cellular phone, but color mixing has to be further reduced in use ofaudio/video (AV) (camcorder, digital still camera and the like).

(2) A light-shielding film is provided in the effective pixel peripheralportion to prevent noise in the peripheral circuit region and determineoptical black level. However, the light-collecting state changes in theeffective pixel peripheral portion by level difference of thelight-shielding film, and thus uniform optical property is not realized.That is, as shown in FIG. 4, the light-shielding film 126 is formedthrough the insulating film 127 from optical black level region(so-called optical black region) 113B outside the effective pixel region13A to the peripheral circuit section 125. On top of this, the on-chipcolor filter 121 and the on-chip microlens 122 are formed. At this time,height difference d of the lens surface of the on-chip microlens 122occurs by the level difference by presence or absence of thelight-shielding film 126, in the peripheral portion of the effectivepixel region 113A and the central part in the inside thereof. Thelight-collecting state changes due to this height difference d, and theperipheral portion becomes dark in comparison to the brightness of thecentral part of the effective pixel region, and thus uniform opticalproperty is not obtained. So-called sensitivity unevenness happens.

(3) Reflection happens by the on-chip microlens 122 or the on-chip colorfilter 121 in photographing using high-intensity light source.Diffracted light is reflected to the seal glass and the like on thepackage of the solid-state imaging device, and further incident thereto,and color mixing happens uniformly to the RGB pixel. By this colormixing, streaky image defect of Mg color (hereinafter, called as flareof Mg color) happens in a radial fashion from the high-intensity lightsource, which is unique in the back-illuminated solid-state imagingdevice.

Specifically, the problems will be described using the green pixel 151Gand the red pixel 151R of FIG. 3 A. The light L that is incident to theon-chip microlens 122 of the green pixel 151G, is incident to thephotodiode PD of the green pixel through the green filter 121G. However,some tilt light La is incident to the photodiode PD of the red pixel151R that is adjacent to the pixel boundary. This is shown withsimulation of the light intensity when the light of 550 nm wavelength isincident to two pixels of the green pixel and the red pixel of FIG. 3 B.In FIG. 3 B, the regional part A represents a part where the lightintensity is strong, the light-colored regional part B represents a partwhere the light intensity is weak, and the heavy-colored regional part(streaky part) C represents a part where the light intensity is almostabsent. The fine periodical streak pattern shows the progress of thelight wave surface. If the light is looked at, which is incident to thephotodiode PD under the light receiving surface 153, it is found thatweak light is incident to the photodiode PD of the red pixel 151R, andcolor mixing happens in the region D shown in the round shape near thepixel boundary.

On the other hand, as shown in FIG. 1, a seal glass 135 is disposedthrough a space 134 in the window of the incident light side of thepackage (not shown) where the back-illuminated CMOS solid-state imagingdevice 131 is stored. Furthermore, an optical low-pass filter 136 isdisposed on this seal glass 135 through the space 134, and an infraredcutoff filter 137 is disposed on this through the space 134.Furthermore, a camera lens 138 is disposed on the upper side. Theincident light L1, which transmits the camera lens 138 and incident tothe solid-state imaging device 131, is reflected partially at eachmedium interface of the solid-state image capturing element 131. Theincident light L1 is mainly reflected at the lens surface of the on-chipmicrolens 122, and the silicon surface that becomes the light receivingsurface. The on-chip microlens 122 is periodically arranged, and thusdiffraction phenomenon occurs. The reflected and diffracted light L2,which has been reflected in the solid-state imaging device 131, isreflected in various angles such as nearly vertical reflection,distant-direction reflection. The light L2 is reflected at the sealglass 135, the optical low-pass filter 136 and the infrared cutofffilter 137, and is incident again to the solid-state imaging device 131as re-incident light L3. Among them, the light diffracted at great angleis reflected at the seal glass 135, and incident again to thesolid-state imaging device 131, which becomes Mg flare 141 in a radialfashion shown in FIG. 2 (see the circular frame E). The white streak(white flare) 142 in a radial fashion occurs due to the iris in cameralens side, and is a phenomenon that also occurs in the front-illuminatedsolid-state imaging device, and cause no such uncomfortable feeling.However, Mg flare 141, which is unique in the back-illuminatedsolid-state imaging device, is noticeable in comparison to the backgreen, for example, when photographing is taken for sunbeams streamingthrough leaves, and becomes problems.

Happening of this Mg flare 141 is due to the treatment of the whitebalance in the process of the signal processing for uniformspectroscopic characteristics of red (R), green (G) and blue (B).Although color mixing is performed for each pixel to be equal byre-incidence of the diffracted light, Mg flare happens since signals ofred (R) and blue (B) come to have greater gain in comparison to that ofgreen (G), and thus are emphasized with the white balance treatment.

In the back-illuminated solid-state imaging device, Mg flare may happenby above-described optical color mixing and reflected light by leakageof incident light to adjacent pixel. However, optical color mixing toadjacent pixel may happen also in the front-illuminated solid-stateimaging device.

SUMMARY OF THE INVENTION

Under the reflection of above-described points, the invention is toprovide a solid-state imaging device, a method of manufacturing thesame, and an electronic apparatus, which improve image quality byreduction of optical color mixing and/or Mg flare.

The invention is to provide a back-illuminated solid-state imagingdevice and a method of manufacturing the same, which improveslight-collecting property, and suppresses optical noise such as flare orsmear. In addition, the invention provides an electronic apparatusincluding the solid-state imaging device.

According to an embodiment of the present invention, there is providedan solid-state imaging device including: a pixel region in which aplurality of pixels composed of a photoelectric conversion section and apixel transistor is arranged; an on-chip color filter; an on-chipmicrolens; and a multilayer interconnection layer in which a pluralityof layers of interconnections is formed through an interlayer insulatingfilm. The solid-state imaging device further includes a light-shieldingfilm formed through an insulating layer in a pixel boundary of a lightreceiving surface in which the photoelectric conversion section isarranged.

The solid-state imaging device according to the invention includes thelight-shielding film formed in the pixel boundary of the light receivingsurface, in which the photoelectric conversion section is arranged,through the insulating layer, therefore, the light which is notcollected by the on-chip microlens is prevented from entering theadjacent pixel by the light-shielding film. In addition, the incidenceof the diffracted light on the effective pixel is suppressed by thislight-shielding film of the pixel boundary.

According to another embodiment of the present invention, there isprovided a method of manufacturing a solid-state imaging deviceincluding the steps of: forming an antireflection film on a backsideused as a light receiving surface of a semiconductor substrate in whicha plurality of pixels composed of a photoelectric conversion section anda pixel transistor is formed; and forming a light-shielding filmselectively in a portion corresponding to a pixel boundary on theantireflection film. After that, the method according to the inventionincludes the steps of: forming a planarization film on theantireflection film that includes the light-shielding film; and formingan on-chip color filter and an on-chip microlens sequentially on theplanarization film.

In the method of manufacturing the solid-state imaging device accordingto the invention, since the antireflection film is formed on thebackside used as the light receiving surface of the semiconductorsubstrate, and the light-shielding film is selectively formed in aportion corresponding to the pixel boundary on the antireflection film,it is possible to form the light-shielding film in a position close tothe light receiving surface. The incidence of the light which is notcollected by the on-chip microlens is suppressed from entering theadjacent pixel by this light-shielding film, and also the incidence ofthe diffracted light on the effective pixel is suppressed. Since theantireflection film is formed on the light receiving surface, reflectionfrom the light receiving surface of the backside of the semiconductorsubstrate is suppressed. Since the planarization film is formed on theantireflection film including the light-shielding film, the problem oflevel difference of the on-chip microlens in the effective pixel regionis resolved.

According to another embodiment of the present invention, there isprovided a method of manufacturing a solid-state imaging deviceincluding the steps of: forming an antireflection film on a backsideused as a light receiving surface of a semiconductor substrate in whicha plurality of pixels composed of a photoelectric conversion section anda pixel transistor is formed; and forming an insulating film on theantireflection film. After that, the method according to the inventionincludes the steps of: forming a light-shielding film selectively in aportion corresponding to a pixel boundary on the insulating film; andforming a planarization film on the antireflection film that includesthe light-shielding film; and forming an on-chip color filter and anon-chip microlens sequentially on the planarization film.

In the method of manufacturing the solid-state imaging device accordingto the invention, the insulating film is formed on the antireflectionfilm, and the light-shielding film is selectively formed in a portioncorresponding to the pixel boundary on this insulating film. A filmthickness of the insulating film is sufficiently thick compared to afilm thickness of the antireflection film, even though the insulatingfilm is more or less cut due to selective processing of thelight-shielding film, spectroscopic sensitivity characteristics are notaffected to a great extent. Since the light-shielding film is formed aposition close to the light receiving surface, the light which is notcollected by the on-chip microlens is suppressed from being incident onthe adjacent pixel, and also the incidence of the diffracted light onthe effective pixel is suppressed. Since the antireflection film isformed on the light receiving surface, reflection from the lightreceiving surface of the backside of the semiconductor substrate issuppressed. Since the planarization film is formed on the antireflectionfilm including the light-shielding film, the problem of level differenceof the on-chip microlens in the effective pixel region is resolved.

According to another embodiment of the present invention, there isprovided a solid-state imaging device including: a pixel region in whicha plurality of pixels composed of a photoelectric conversion section anda pixel transistor is arranged; an on-chip color filter; and an on-chipmicrolens having an antireflection film on a lens plane of a surfacethereof. Further, the solid-state imaging device includes a multilayerinterconnection layer in which a plurality of layers of interconnectionsis formed through an interlayer insulating film. In the solid-stateimaging device, the pixel transistor and the multilayer interconnectionlayer are configured as a back-illuminated type formed in a sideopposite to a light receiving surface in which the photoelectricconversion section is arranged.

In the solid-state imaging device according to the invention, since theantireflection film is formed along the lens plane of the surface of theon-chip microlens in the back-illuminated type, the reflected light fromthe surface of the on-chip microlens is reduced, and the intensity ofthe diffracted light is reduced.

According to another embodiment of the present invention, there isprovided a solid-state imaging device including: a pixel region in whicha plurality of pixels composed of a photoelectric conversion section anda pixel transistor is arranged; an on-chip color filter formed in alight receiving surface of the pixel region; and an on-chip microlensformed on the on-chip color filter. Further, the solid-state imagingdevice includes: a transparent planarization film, which is uniformlyand continuously formed on each of the on-chip microlenses correspondingto a plurality of pixels; and a multilayer interconnection layer inwhich a plurality of layers of interconnections is formed through aninterlayer insulating film. In the solid-state imaging device, the pixeltransistor and the multilayer interconnection layer are configured as aback-illuminated type formed in a side opposite to the light receivingsurface of the pixel region.

In the solid-state imaging device according to the invention, since theplanarization film is formed uniformly and continuously on each of theon-chip microlenses corresponding to a plurality of pixels, the problemof periodic concavity and convexity in the on-chip microlens is solved,and generation of the diffracted light is suppressed. Herewith, theincidence of the diffracted light on the effective pixel is suppressed.

According to another embodiment of the present invention, there isprovided an electronic apparatus including: a solid-state imagingdevice, an optical system that leads incident light to the solid-stateimaging device, and a signal processing circuit that processes an outputsignal of the solid-state imaging device. The solid-state imaging deviceincludes: a pixel region in which a plurality of pixels composed of aphotoelectric conversion section and a pixel transistor is arranged; anon-chip color filter; and an on-chip microlens. Further, the solid-stateimaging device includes: a multilayer interconnection layer in which aplurality of layers of interconnections is formed through an interlayerinsulating film; and a light-shielding film formed through an insulatinglayer in a pixel boundary of a light receiving surface in which thephotoelectric conversion section is arranged.

The electronic apparatus according the invention includes thesolid-state imaging device having the light-shielding film in the pixelboundary according to the invention. Therefore, in the solid-stateimaging device, it is possible to prevent the light which is notcollected by the on-chip microlens from entering the adjacent pixel, andto block the incidence of the diffracted light on the effective pixel.

In order to address the above-identified and other problems, thesolid-state imaging device according to the invention includes asubstrate, an interconnection layer, and a light-shielding portion. Aplurality of light-receiving portions is formed in the substrate, andthe backside of the substrate is used as a light illumination surface.In addition, the interconnection layer is formed in surface side of thesubstrate. In addition, the light-shielding portion is formed betweenthe adjacent light-receiving portions, and is constituted by a trenchportion formed in a desired depth from the backside of the substrate,and a light-shielding film buried within the trench portion.

In the solid-state imaging device according to the invention, aplurality of light-receiving portions formed in the substrate isisolated by the light-shielding portion formed by burying the trenchportion, which is formed in a desired depth from the backside of thesubstrate, with the light-shielding film. For this reason, when theoblique light enters from the backside of the substrate used as a lightillumination surface, the oblique incident light is shielded by thelight-shielding portion. Herewith, the incidence of the oblique light onthe light-receiving portion formed in the substrate is suppressed.

Further, according to another embodiment of the present invention, thereis provided a method of manufacturing a solid-state imaging deviceincluding the steps of: first, forming a plurality of light-receivingportions and a desired impurity region in a surface region of asubstrate in which an etching stopper layer is formed in a backsideregion thereof; and next, forming an interconnection layer, which iscomposed of a plurality of layers of interconnections formed through aninterlayer insulating film, in a surface side of the substrate. Next,the method includes the step of thinning the substrate from the backsideof the substrate. In the thinning step, etching is performed up to theetching stopper. Next, the method includes the step of forming a trenchportion that reaches a desired depth from the backside of the substratepassing through the substrate. Next, the method includes the step offorming a burying film in a trench portion formed in the substrate, andthinning the substrate by using the burying film as a stopper. Next, themethod includes the step of burying a light-shielding film in the trenchportion, after the burying film is removed.

In the method of manufacturing the solid-state imaging device accordingto the invention, the optical lens, the above-mentioned solid-stateimaging device, and the signal processing circuit are included.

With the solid-state imaging device according to the invention, theincidence of the light on the adjacent pixel is suppressed by thelight-shielding film of the pixel boundary, to thereby allow opticalcolor mixing to be reduced. In addition, the incidence of the diffractedlight on the effective pixel is suppressed by the light-shielding filmof the pixel boundary, to thereby allow generation of Mg flare to bereduced. Therefore, it is possible to achieve improvement in an imagequality by reduction in optical color mixing and/or reduction in Mgflare.

With the method of manufacturing the solid-state imaging deviceaccording to the invention, it is possible to manufacture a solid-stateimaging device capable of achieving improvement in an image quality byreduction in optical color mixing and/or reduction in Mg flare.

With the solid-state imaging device according to the invention, in theback-illuminated device, the antireflection film is formed in thesurface of the on-chip microlens, and the intensity of the diffractedlight is reduced by reducing the reflected light from the on-chipmicrolens, to thereby allow generation of Mg flare to be reduced, and toallow improvement in an image quality to be achieved.

With the solid-state imaging device according to the invention, in theback-illuminated device, the planarization film is uniformly andcontinuously formed on each of the on-chip microlenses, and theincidence of the diffracted light on the effective pixel is suppressed,to thereby allow generation of Mg flare to be reduced, and to allowimprovement in an image quality to be achieved.

With the electronic apparatus according to the invention, in thesolid-state imaging device, optical color mixing can be reduced, and Mgflare can be reduced, to thereby allow a high-quality image to beobtained.

According to the invention, it is possible to improve flarecharacteristics or smear characteristics, and to obtain a solid-stateimaging device in which color mixing or blooming is suppressed. Inaddition, an electronic apparatus, in which improvement in an imagequality is achieved, is obtained by using such a solid-state imagingdevice.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram illustrating of a reflection state ofincident light in a back-illuminated solid-state imaging device of therelated art;

FIG. 2 is an explanatory diagram illustrating a state where Mg flare isgenerated in the back-illuminated solid-state imaging device of therelated art;

FIGS. 3A and 3B are explanatory diagrams illustrating generation ofoptical color mixing in an adjacent pixel of the back-illuminatedsolid-state imaging device of the related art;

FIG. 4 is an explanatory diagram illustrating that the difference in alens height of an on-chip microlens of an effective pixel region isgenerated in the back-illuminated solid-state imaging device of therelated art;

FIG. 5 is a schematic diagram illustrating a front-illuminatedsolid-state imaging device of the related art;

FIG. 6 is a schematic diagram illustrating the back-illuminatedsolid-state imaging device of the related art;

FIG. 7 is a schematic configuration diagram illustrating an example of aCMOS solid-state imaging device applied to the present invention;

FIG. 8 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a firstembodiment of the invention;

FIGS. 9A and 9B are explanatory diagrams illustrating a state whereoptical color mixing in an adjacent pixel according to the embodiment ofthe invention is reduced;

FIG. 10 is an explanatory diagram illustrating a reflection state ofincident light according to the embodiment of the invention;

FIG. 11 is an explanatory diagram in which Mg flare according to theembodiment of the invention is reduced;

FIGS. 12A and 12B are first manufacturing process diagrams illustratinga manufacturing process of a solid-state imaging device according to afirst embodiment;

FIGS. 13A and 13B are second manufacturing process diagrams illustratingthe manufacturing process of the solid-state imaging device according tothe first embodiment;

FIG. 14 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a secondembodiment of the invention;

FIGS. 15A and 15B are first manufacturing process diagrams illustratinga manufacturing process of the solid-state imaging device according tothe second embodiment;

FIGS. 16A and 16B are second manufacturing process diagram illustratingthe manufacturing process of the solid-state imaging device according tothe second embodiment;

FIGS. 17A to 17C are plan views illustrating each example of apertureshapes of a light-shielding film according to the invention;

FIG. 18 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a thirdembodiment of the invention;

FIG. 19 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a fourthembodiment of the invention;

FIG. 20 is a partial plan view illustrating the back-illuminatedsolid-state imaging device according to the fourth embodiment of theinvention;

FIG. 21 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a fifthembodiment of the invention;

FIG. 22 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a sixthembodiment of the invention;

FIG. 23 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a seventhembodiment of the invention;

FIG. 24 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to an eighthembodiment of the invention;

FIG. 25 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a ninthembodiment of the invention;

FIG. 26 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a tenthembodiment of the invention;

FIG. 27 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to an eleventhembodiment of the invention;

FIG. 28 is a partial configuration diagram illustrating aback-illuminated solid-state imaging device according to a twelfthembodiment of the invention;

FIG. 29 is a partial configuration diagram illustrating afront-illuminated solid-state imaging device according to a thirteenthembodiment of the invention;

FIG. 30 is a partial configuration diagram illustrating afront-illuminated solid-state imaging device according to a fourteenthembodiment of the invention;

FIG. 31 is a cross-sectional configuration diagram in a pixel section ofa solid-state imaging device according to a sixteenth embodiment;

FIG. 32 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 33 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 34 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 35 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 36 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 37 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 38 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIG. 39 is a manufacturing process diagram of the solid-state imagingdevice according to the sixteenth embodiment;

FIGS. 40A and 40B are manufacturing process diagrams of the solid-stateimaging device according to the sixteenth embodiment;

FIGS. 41A and 41B are manufacturing process diagrams of the solid-stateimaging device according to the sixteenth embodiment;

FIG. 42 is a cross-sectional configuration diagram in a pixel section ofa solid-state imaging device according to a seventeenth embodiment ofthe invention; and

FIG. 43 is a schematic configuration diagram of an electronic apparatusaccording to a fifteenth embodiment and an eighteenth embodiment of theinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, best mode for carrying out the invention (hereinafter,referred to as the embodiment) will be described.

The description is performed in the following order.

1. Schematic Configuration Example of CMOS Solid-State Imaging Device

2. First Embodiment (Configuration Example of Solid-State Imaging Deviceand Example of Method of Manufacturing the Same)

3. Second Embodiment (Configuration Example of Solid-State ImagingDevice and Example of Method of Manufacturing the Same)

4. Third Embodiment (Configuration Example of Solid-State ImagingDevice)

5. Fourth Embodiment (Configuration Example of Solid-State ImagingDevice)

6. Fifth Embodiment (Configuration Example of Solid-State ImagingDevice)

7. Sixth Embodiment (Configuration Example of Solid-State ImagingDevice)

8. Seventh Embodiment (Configuration Example of Solid-State ImagingDevice)

9. Eighth Embodiment (Configuration Example of Solid-State ImagingDevice)

10. Ninth Embodiment (Configuration Example of Solid-State ImagingDevice)

11. Tenth Embodiment (Configuration Example of Solid-State ImagingDevice)

12. Eleventh Embodiment (Configuration Example of Solid-State ImagingDevice)

13. Twelfth Embodiment (Configuration Example of Solid-State ImagingDevice)

14. Thirteenth Embodiment (Configuration Example of Solid-State ImagingDevice)

15. Fourteenth Embodiment (Configuration Example of Solid-State ImagingDevice)

16. Fifteenth Embodiment (Configuration Example of Electronic Apparatus)

In addition, a solid-state imaging device, a method of manufacturing thesame, and an example of an electronic apparatus according to theembodiments of the invention will be described in the following orderwith reference to FIGS. 7, 31 to 43. However, the invention is notlimited to the following examples.

17. Sixteenth Embodiment (Solid-State Imaging device)

17.1 Configuration of the Whole Solid-State Imaging device

17.2 Partial Configuration

17.3 Method of Manufacturing Solid-State Imaging device

18. Seventeenth Embodiment (Solid-State Imaging device)

19. Eighteenth Embodiment (Electronic Apparatus)

Although improvement of the image quality is contrived by reduction inoptical color mixing and/or reduction in Mg flare in the solid-stateimaging device according to the embodiment of the invention, a method ofreducing Mg flare will be set forth prior to the description of theembodiments.

The intensity of Mg flare 141 unique to the back-illuminated solid-stateimaging device generally has the following relationship as a result ofthe analysis.

Mg flare intensity=intensity of incident light×reflectance of imagesensor tilt×reflectance of seal glass and the like×sensitivity of imagesensor tilt.

Therefore, the method of reducing Mg flare is mainly considered in threeways. A: a method of suppressing generation of diffracted light L2 bydevising a pixel structure. B: a method of forming an antireflectionfilm on an interface of seal glass and the like. C: a method of reducingdiffracted light L3 which is re-reflected from the seal glass and thelike and comes back by devising the pixel structure.

Since Method B is not a wafer manufacturing process of an image sensor,but is a method for a package side, the price of the image sensor risessignificantly. However, this leads to a great advantage for the trend toreduction in retail price of a recent digital video camera or digitalstill camera which is for use by consumers.

Method A is a method for a wafer manufacturing process of an imagesensor, and price rise is relatively slight. Method A is substantive ina sense that generation source of diffracted light is suppressed, andthere is an advantage of improvement in sensitivity by setting a filmforming condition properly. However, there is no effect of reductionwith respect to optical color mixing which is a problem generated in aback-illuminated solid-state imaging device for a digital video cameraor digital still camera which is for use by consumers.

Method C is a method for a wafer manufacturing process of an imagesensor similar to Method A, and this leads to a great advantage for noprice rise in the embodiments of the invention. Method C is a methodwhere the amount of generation of the diffracted light and seal glassreflectance are all varied, but is effective in settling Mg flare bysuppressing image sensor tilt sensitivity greatly taken in theback-illuminated solid-state imaging device. In addition,simultaneously, it is also effective in optical color mixing which is aproblem generated in the back-illuminated solid-state imaging device fora digital video camera or digital still camera which is for use byconsumers. The light-shielding film is configured to be capable of beingmaintaining excellencies in optical characteristics (high sensitivityand low shading) expected as an optical back-illuminated solid-stateimaging device and to sufficiently suppress Mg flare and optical colormixing by setting an aperture design properly.

The embodiments of the back-illuminated solid-state imaging device asdescribed below are on the basis of Method A and/or Methods B and C withrespect to reduction in Mg flare.

1. Schematic Configuration Example of CMOS Solid-State Imaging Device

FIG. 7 shows a schematic configuration of an example of the CMOSsolid-state imaging device applied to each embodiment of the invention.As shown in FIG. 7, the solid-state imaging device 1 according to theexample includes a pixel region (so-called image capturing region) 3 inwhich pixels 2 including a plurality of photoelectric conversionelements in a semiconductor substrate 11, for example, a siliconsubstrate are regularly two-dimensionally arranged, and a peripheralcircuit section. The pixels 2 include for example photodiodes which arethe photoelectric conversion elements, and a plurality of pixeltransistors (so-called MOS transistors). A plurality of pixeltransistors is capable of being constituted by three transistors of forexample a transfer transistor, a reset transistor and an amplifyingtransistor. Besides, it is also possible to be constituted by fourtransistors by adding a selective transistor. An equivalent circuit ofthe unit pixel is similar to the ordinary, therefore the detaileddescription thereof will be omitted. The pixels 2 may be also configuredto be a shared pixel structure. This pixel shared structure isconstituted by a plurality of photodiodes, a plurality of transfertransistors, one floating diffusion being shared, and another pixeltransistor being shared one by one.

As in the following, embodiments of the present invention includeback-illuminated solid-state imaging devices 21, 51, 57, 59, 63, 67, 71,74, 77, 79, 81, and 83, a semiconductor substrate 22, a substratesurface 22A, a substrate backside 22B, a photodiode PD, a pixeltransistor Tr, a light receiving surface 34, an antireflection film 36,a light-shielding film 39, a planarization film 41, an on-chip colorfilter 42, an on-chip microlens 43, and front-illuminated solid-stateimaging devices 85 and 89.

The peripheral circuit section includes a vertical drive circuit 4, acolumn signal processing circuit 5, a horizontal drive circuit 6, anoutput circuit 7, and a control circuit 8.

The control circuit 8 receives data for giving instructions on inputclock and operation mode, and also outputs data such as internalinformation of the solid-state imaging device. That is, the controlcircuit 8 generates a clock signal or a control signal which is areference of operation of the vertical drive circuit 4, the columnsignal processing circuit 5 and the horizontal drive circuit 6 and thelike on the basis of a vertical synchronization signal, a horizontalsynchronization signal and a master clock. These signals are then inputto the vertical drive circuit 4, the column signal processing circuit 5and the horizontal drive circuit 6 and the like.

The vertical drive circuit 4 is constituted by, for example, a shiftregister, selects a pixel drive interconnection, supplies a pulse fordriving the pixels to the selected pixel drive interconnection, anddrives the pixels in row unit. That is, the vertical drive circuit 4selectively scans each pixel 2 of the pixel region 3 in a row unit in asequential vertical direction, and supplies a pixel signal to the columnsignal processing circuit 5, which is based on a signal charge generatedin response to the amount of light received at, for example, thephotodiode used as a photoelectric conversion element of each pixel 2through a vertical signal line 9.

The column signal processing circuits 5 is disposed, for example, foreach column of the pixel 2, and performs signal processing such asdenoising for each pixel column with respect to a signal output from thepixels 2 for one row. That is, the column signal processing circuit 5performs signal processing such as CDS, signal amplification, or ADconversion for removing fixed pattern noise unique to the pixel 2. In anoutput stage of the column signal processing circuit 5, a horizontalselective switch (not shown) is provided connected between a horizontalsignal line 10 and the output stage.

The horizontal drive circuit 6 is constituted by, for example, shiftregisters, and sequentially outputs horizontal scan pulses, so that thehorizontal drive circuit selects each of the column signal processingcircuits 5 in order, and then outputs pixel signals from each of thecolumn signal processing circuits 5 to the horizontal signal line 10.

The output circuit 7 performs signal processing for signals sequentiallysupplied from each of the column signal processing circuits 5 throughthe horizontal signal line 10, and outputs the signals. For example,there may be cases where only buffering is performed, and may also becases where black level adjustment, column variation correction, varioustypes of digital signal processing and the like are performed. An inputand output terminal 12 exchanges signals with the outside.

2. First Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 8 shows the first embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device.The solid-state imaging device 21 according to the first embodimentforms, for example, a pixel region (so-called image capturing region) 23in which a plurality of pixels is arranged in a semiconductor substrate22 made of silicon, and a peripheral circuit section (not shown)disposed in a periphery of the pixel region 23. A unit pixel 24 isconstituted by a photodiode PD used as a photoelectric conversionsection and a plurality of pixel transistors Tr. The photodiode PD isformed so as to extend over the whole region in a thickness direction ofthe semiconductor substrate 22, and is configured as a p-n junction typephotodiode composed of a first conductivity type, which is an n-typesemiconductor region 25 in the example, and a second conductivity typefacing both sides of the substrate, which is a p-type semiconductorregion 26 in the example. The p-type semiconductor region facing bothsides of the substrate further includes a hole charge accumulationregion for suppressing dark current.

Each of the pixels 24 composed of the photodiode PD and the pixeltransistor Tr is isolated by an element isolation region 27. The elementisolation region 27 is formed and, for example, grounded by the p-typesemiconductor region. The pixel transistor Tr forms a n-type sourceregion and a drain region, which are not shown, in a p-typesemiconductor well region 28 formed on a surface 22A side of thesemiconductor substrate 22, and forms a gate electrode 29 on thesubstrate surface between both regions through a gate insulating film.In the same drawing, a plurality of pixel transistors is shown asrepresented by one pixel transistor Tr, and is schematically indicatedby the gate electrode 29.

So-called multilayer interconnection layers 33, where a plurality oflayers of interconnections 32 is disposed through an interlayerinsulating film 31, are formed on the surface 22A of the semiconductorsubstrate 22. Since the sides of the multilayer interconnection layers33 are configured so that light is not incident, it is possible for alayout of the interconnections 32 to be freely set up.

An insulating layer is formed on a substrate backside 22B used as alight receiving surface 34 of the photodiode PD. This insulating layeris formed by an antireflection film 36 in the example. Theantireflection film 36 is formed by a multilayer film having a differentrefractive index, and is formed by a two-layer film made of a hafniumoxide (HfO₂) film 38 and a silicon oxide film 37 in the example.

In the embodiment, a light-shielding film 39 is formed at a pixelboundary on this antireflection film 36, that is, a portioncorresponding to the pixel boundary. This light-shielding film 39 may bea light-shielding material. Meanwhile, it is preferable to form thelight-shielding film with a film of metal, for example, aluminum (Al),or tungsten (W), or copper (Cu) as a material which has stronglight-shielding properties, and is capable of being processed with goodaccuracy using microfabrication, for example, etching.

A planarization film 41 is formed on the antireflection film 36including the light-shielding film 39, and an on-chip color filter 42and an on-chip microlens 43 thereon are sequentially formed on thisplanarization film 41. The on-chip microlens 43 is formed by, forexample, organic materials such as resin. The planarization film 41 maybe formed by, for example, organic materials such as resin. As anon-chip color filter, for example, a color filter of Bayer array isused. The light L enters from the substrate backside 22B, and iscollected by the on-chip microlens 43 and then received in each of thephotodiodes PD.

With the back-illuminated solid-state imaging device 21 according to thefirst embodiment, since the light-shielding film 39 is formed in thepixel boundary very close to the light receiving surface 34, lighttravelling to an adjacent pixel is shielded without being collected bythe on-chip microlens 43. That is, it is possible to prevent the lightfrom being incident on the adjacent pixel by the light-shielding film 39of the pixel boundary, and to reduce optical color mixing. In addition,even though the light is incident on the solid-state imaging device 21disposed within a package, and then diffracted light partially reflectedis re-reflected by the seal glass to thereby be incident on thesolid-state imaging device 21, incidence of the diffracted light isprevented by the light-shielding film 39 of the pixel boundary. Sincethe incidence of this diffracted light is blocked, in particular, it ispossible to reduce Mg flare when photographing using high-intensitylight source.

As shown in FIG. 9, reduction in optical color mixing will be describedin detail using simulation of light intensity when light of a 550 nmwavelength is incident on two pixels of a green pixel and a red pixel.FIG. 9 A shows a green pixel 24G and a red pixel 24R. When the light istransmitted on the on-chip microlens 43 and is incident on the greenpixel 24G, although light L0 which is not partially collected travels tothe red pixel 24R which is an adjacent pixel, the light L0 is shieldedby the light-shielding film 39 and is reflected. That is, incidence ofthe light L0 on the red pixel 24R is blocked. Such an appearance isshown by simulation of light intensity of FIG. 9B. In FIG. 9B, asmentioned above, a region A is a portion having strong light intensity,a light-colored portion B is a portion having weak light intensity, anda heavy-colored portion is a portion having hardly any light intensity.As can be seen from the simulation of FIG. 9 B, the light intensity inthe boundary vicinity D to the green pixel 24G of the photodiode PD ofthe red pixel 24R is almost equal to zero. That is, optical color mixingis reduced.

On the other hand, reduction of Mg flare will be described in detail.FIG. 10 shows a reflection state of the incident light in the statewhere the solid-state imaging device 21 according to the firstembodiment is received within the package. As mentioned above, the sealglass 135 is disposed in a window of the incident light side of thepackage (not shown) in which the back-illuminated solid-state imagingdevice 21 is received through the space 134. Further, the opticallow-pass filter 136 is disposed the seal glass 135 through the space134, and the infrared (IR) cutoff filter 137 is disposed thereon throughthe space 134. Further, the camera lens 138 is disposed thereon.

As described above, the incident light L1, which transmits the cameralens 138 and is incident on the solid-state imaging device 21, isreflected by each of the medium interfaces of the solid-state imagingdevice 21. This reflected light is reflected by the seal glass 135, theoptical low-pass filter 136, and the infrared cutoff filter 137 and isincident again on the solid-state imaging device 21 side. The diffractedlight L2 reflected even from the center at a large angle is reflected bythe seal glass 135, and is incident again on the solid-state imagingdevice 21 as the light L3 incident again. However, at this time, asshown by a circular frame 45, the incidence of the diffracted light onthe effective pixel is blocked by the light-shielding film 39, wherebyMg flare is not generated. As shown in FIG. 10, although the diffractedlight L3, which is reflected by the green pixel 24G and is re-reflect,travels to the adjacent red pixel 24R side through a green filter ofanother green pixel 24G, the diffracted light L3 is reflected by thelight-shielding film 39 of the pixel boundary (see solid arrows), and isnot incident on the red pixel 24R. For this reason, as shown in FIG. 11,when photographing using high-intensity light source, Mg flare does notappear at the same place (see circular frame E) that Mg flare appears inFIG. 27 described above.

Further, in the embodiment, after the light-shielding film 39 is formed,the on-chip color filter 42 and the on-chip microlens 43 are formedthrough the planarization film 41. Since the on-chip microlens 43 isformed through this planarization film 41, all of the on-chipmicrolenses 43 on the pixel region are of equal lens height. Inparticular, the on-chip microlenses 43 of the effective pixel region areof equal lens height, whereby there is no level difference d generatedbetween the peripheral portion and the central region in the effectivepixel region shown in FIG. 29 described above. Therefore, the sameluminance is obtained in the whole screen, that is, there is nosensitivity unevenness generated and improvement in image quality isachieved.

In this manner, the solid-state imaging device 21 is configured todispose the light-shielding film 39 in the pixel boundary of a positionclose to the light receiving surface, so that optical color mixing canbe reduced, and Mg flare can be reduced. Further, in the solid-stateimaging device 21, sensitivity unevenness within the effective pixelregion is not generated, which thereby allows the high-quality image tobe photographed.

Thus, the back-illuminated solid-state imaging device 21 according tothe first embodiment allows improvement in the image quality to beachieved.

Example of Method of Manufacturing Solid-State Imaging Device Accordingto the First Embodiment

FIG. 12 and FIG. 13 show a method of manufacturing the solid-stateimaging device 21 according to the first embodiment. In any of the samedrawings, a portion of the substrate surface sides is omitted and theonly partial cross-sectional structure is shown. Reference numerals andsigns of omitted parts refer to FIG. 8.

First of all, the photodiodes PD corresponding to each of the pixels,which are isolated by the element isolation region 27 formed of thep-type semiconductor region, are formed on, for example, a region inwhich the pixel region of the silicon semiconductor substrate 22 is tobe formed. The photodiodes PD include p-n junctions composed of then-type semiconductor region 25 extending over the whole region in athickness direction of the substrate, and the p-type semiconductorregion 26 facing both sides 22A and 22B of the substrate in contact withthe n-type semiconductor region 25. The p-type semiconductor wellregions 28 which are each in contact with the element isolation regions27 are formed in regions corresponding to each pixel of the substratesurface 22A, and a plurality of each of the pixel transistors Tr isformed within the p-type semiconductor well regions 28. The pixeltransistors Tr are each formed by the source region and the drainregion, the gate insulating film, and the gate electrode 29. Further,the multilayer interconnection layers 33 in which a plurality of layersof interconnections 32 is disposed through the interlayer insulatingfilm 31 are formed on the substrate surface 22A.

Next, as shown in FIG. 12A, the insulating film, or the antireflectionfilm 36 in the example is formed on the substrate backside 22B used as alight receiving surface, and a light-shielding film material layer 39Ais formed on this antireflection film 36. The antireflection film 36 isformed by a plurality of layers having a different refractive index, andis formed by a two-layer film in which the silicon oxide (SiO₂) film 37and the hafnium oxide (HfO₂) film 38 are stacked from the substratebackside 22B side in the example. The silicon oxide film 37 and hafniumoxide film 38 are each formed with a film thickness optimal forantireflection. The light-shielding film material layer 39A is formed bymaterials excellent in light-shielding property and workability, such asaluminum (Al) or tungsten (W).

Next, a resist mask 47 is selectively formed on the light-shielding filmmaterial layer 39A. The resist mask 47 includes an aperture in a portioncorresponding to the photodiode PD, and is formed in a lattice shapewhen seen in a plan view in order for portions corresponding to each ofthe pixel boundaries to remain. As shown in FIG. 12B, thelight-shielding film material layer 39A is selectively etched andremoved through the resist mask 47, to thereby form the light-shieldingfilm 39 in each of the pixel boundaries. The etching may use wet etchingor dry etching. It is preferable to use dry etching since a fine linewidth of the light-shielding film 39 is obtained with good accuracy.

Next, as shown in FIG. 13A, the planarization film 41 is formed on theantireflection film including the light-shielding film 39. Thisplanarization film 41 is formed by applying organic materials such as,for example, resin.

Next, as shown in FIG. 13B, the on-chip color filter 42 and the on-chipmicrolens 43 of, for example, Bayer array are sequentially formed on theplanarization film 41. In this manner, the solid-state imaging device 21according to a purpose of the first embodiment is obtained.

With a method of manufacturing the solid-state imaging device accordingto the embodiment, the light-shielding film 39 is selectively formed ina portion corresponding to the pixel boundary through the antireflectionfilm 36 on the backside 22B used as a light receiving surface of thesemiconductor substrate 22, to thereby allow the light-shielding film 39to be formed in a position close to the light receiving surface 34. Thelight-shielding film 39 is formed in a position close to the lightreceiving surface, whereby it is possible to prevent the light which isnot collected by the on-chip microlens 43 from entering the adjacentpixel. In addition, this light-shielding film prevents the incidence ofthe diffracted light which causes generation of Mg flare on theeffective pixel. Since the antireflection film 36 is formed on the lightreceiving surface 34, reflection of the substrate backside 22B from thelight receiving surface 34 is suppressed, and high sensitivity isachieved. Further, since the on-chip color filters 42 and the on-chipmicrolenses 43 are formed through the planarization film 41, the lensheights of the on-chip microlenses 43 can be made uniform within theeffective screen region. Therefore, the manufacturing method can reduceoptical color mixing, reduce Mg flare by suppressing the incidence ofthe diffracted light on the effective pixel, and manufacture thesolid-state imaging device according to the first embodiment whichachieves uniformity and high sensitivity within the effective pixelregion, with ease and a high degree of accuracy.

3. Second Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 14 shows the second embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device.Similar to the first embodiment, the solid-state imaging device 51according to the second embodiment forms, for example, a pixel region 23in which a plurality of pixels is arranged in a semiconductor substrate22 made of silicon, and a peripheral circuit section (not shown)disposed in a periphery of the pixel region 23. A logic circuit isformed in the peripheral circuit section. A unit pixel 24 is constitutedby a photodiode PD used as a photoelectric conversion section and aplurality of pixel transistors Tr. The photodiode PD is formed so as toextend over the whole region in a thickness direction of thesemiconductor substrate 22, and is configured as a p-n junction typephotodiode composed of a first conductivity type, which is an n-typesemiconductor region 25 in the example, and a second conductivity typefacing both sides of the substrate, which is a p-type semiconductorregion 26 in the example. The p-type semiconductor region facing bothsides of the substrate further includes a charge accumulation region forsuppressing dark current.

Each of the pixels 24 composed of the photodiode PD and the pixeltransistor Tr is isolated by an element isolation region 27. The elementisolation region 27 is formed and, for example, grounded by the p-typesemiconductor region. The pixel transistor Tr forms a n-type sourceregion and a drain region, which are not shown, in a p-typesemiconductor well region 28 formed on a surface 22A side of thesemiconductor substrate 22, and forms a gate electrode 29 on thesubstrate surface between both regions through a gate insulating film.In the same drawing, a plurality of pixel transistors is shown asrepresented by one pixel transistor Tr, and is schematically indicatedby the gate electrode 29.

So-called multilayer interconnection layers 33 in which a plurality oflayers of interconnections 32 is disposed through an interlayerinsulating film 31 are formed on the surface 22A of the semiconductorsubstrate 22. Since the sides of the multilayer interconnection layers33 are configured so that light is not incident, it is possible for alayout of the interconnections 32 to be freely set up.

An insulating layer is formed on a substrate backside 22B used as alight receiving surface 34 of the photodiode PD. This insulating layeris formed by an antireflection film 36 in the example. Theantireflection film 36 is formed by a multilayer film having a differentrefractive index, and is formed by a two-layer film made of a hafniumoxide (HfO₂) film 37 and a silicon oxide film 38 in the example.

In the embodiment, particularly, the insulating film 52 is formed onthis antireflection film 36, and a light-shielding film 39 is formed atthe pixel boundary on this insulating film 52. The insulating film 52 isset up so as for a film type and a film thickness thereof to be anoptically appropriate value. The insulating film 52 is preferable to beformed by, for example, a silicon oxide film, and is set up so as forfilm thickness thereof to be sufficiently thicker than at least a filmthickness of the antireflection film 36. The light-shielding film 39 maybe a light-shielding material. Meanwhile, it is preferable to form thelight-shielding film with a film of metal, for example, aluminum (Al),or tungsten (W), or copper (Cu) as a material which has stronglight-shielding properties, and is capable of being processed with goodaccuracy using microfabrication, for example, etching.

It is preferable that the insulating film 52 is a film having largerrefractive index difference than that of a high refractive index film ofan upper layer constituting the antireflection film 36, which is thehafnium oxide (HfO₂) film 38 in the example. For example, a siliconoxide film is preferable. For example, when the insulating film 52 isformed by a silicon nitride (SiN) film having a refractive index closeto that of the hafnium oxide (HfO₂) film, a film thickness of thehafnium oxide film 38 becomes substantially thicker, and thereby isinappropriate as an antireflection film.

A planarization film 41 is formed on the insulating film 52 includingthe light-shielding film 39, and an on-chip color filter 42 and anon-chip microlens 43 thereon are sequentially formed on thisplanarization film 41. The planarization film 41 may be formed by, forexample, organic materials such as resin. The planarization film 41 maybe formed by, for example, organic materials such as resin. As anon-chip color filter, for example, a color filter of Bayer array isused. The light L enters from the substrate backside 22B, and iscollected by the on-chip microlens 43 and then received in each of thephotodiodes PD.

With the back-illuminated solid-state imaging device 51 according to thesecond embodiment, the insulating film 52 of which film thickness isthicker than that of the antireflection film 36 is formed on theantireflection film 39, and the light-shielding film 36 is formed at aportion corresponding to the pixel boundary on the insulating film 52,therefore the optimal antireflection film 36 is maintained. That is,formation of the light-shielding film 36 is patterned by selectiveetching, after the light-shielding film material layer is formed in thewhole surface. In this selective etching, even though an underlyinglayer receives an etching damage, the damage is received by theinsulating film 52, therefore the antireflection film 36 is not affectedat all.

In the back-illuminated solid-state imaging device, it is necessary tostably control film thickness of the antireflection film 36 to bepreviously formed in a silicon interface in order to stably producesensitivity or spectroscopic characteristics. When reduction in a filmon the antireflection film 36 is generated when processing of thelight-shielding film 36, variation of sensitivity or spectroscopiccharacteristics occurs. Since the insulating film 52 is formed on theantireflection film 36 prior to the formation of the light-shieldingfilm 36, sensitivity or spectroscopic characteristics becomes stable.

Furthermore, the solid-state imaging device 51 according to the secondembodiment exhibits the same effect as described in the firstembodiment. That is, since the light-shielding film 39 is formed in thepixel boundary very close to the light receiving surface 34, lighttravelling to an adjacent pixel is shielded without being collected bythe on-chip microlens 43. That is, it is possible to prevent the lightfrom being incident on the adjacent pixel by the light-shielding film 39of the pixel boundary, and to reduce optical color mixing. In addition,even though the light is incident on the solid-state imaging device 21disposed with a package, and then diffracted light partially reflectedis re-reflected by the seal glass to thereby being incident on thesolid-state imaging device 51, incidence of the diffracted light isprevented by the light-shielding film 39 of the pixel boundary. For thisreason, in particular, it is possible to reduce Mg flare whenphotographing using high-intensity light source.

Since the on-chip microlens 43 is formed through this planarization film41, all of the on-chip microlenses 43 on the pixel region are of equallens height. In particular, the on-chip microlenses 43 of the effectivepixel region are of equal lens height, whereby there is no leveldifference d generated between the peripheral portion and the centralregion in the effective pixel region shown in FIG. 4 described above.Therefore, the same luminance is obtained in the whole screen, that is,there is no sensitivity unevenness generated and improvement in imagequality is achieved.

In this manner, the solid-state imaging device 51 is configured todispose the light-shielding film 39 in the pixel boundary of a positionclose to the light receiving surface, so that optical color mixing canbe reduced, and Mg flare can be reduced. Further, in the solid-stateimaging device 51, sensitivity unevenness within the effective pixelregion is not generated, which thereby allows the high-quality image tobe photographed. Thus, the back-illuminated solid-state imaging device51 according to the second embodiment allows improvement in the imagequality to be achieved.

Example of Method of Manufacturing Solid-State Imaging Device Accordingto the Second Embodiment

FIG. 15 and FIG. 16 show a method of manufacturing the solid-stateimaging device 51 according to the second embodiment. In any of the samedrawings, a portion of the substrate surface sides is omitted and theonly partial cross-sectional structure is shown. Reference numerals andsigns of omitted parts refer to FIG. 14.

As mentioned above, first of all, the photodiodes PD corresponding toeach of the pixels, which are isolated by the element isolation region27 formed of the p-type semiconductor region, are formed on, forexample, a region in which the pixel region of the silicon semiconductorsubstrate 22 is to be formed. The photodiodes PD include p-n junctionscomposed of the n-type semiconductor region 25 extending over the wholeregion in a thickness direction of the substrate, and the p-typesemiconductor region 26 facing both sides 22A and 22B of the substratein contact with the n-type semiconductor region 25. The p-typesemiconductor well regions 28 which are contact with the elementisolation regions, respectively, are formed in regions corresponding toeach pixel of the substrate surface 22A, and a plurality of each of thepixel transistors Tr is formed within the p-type semiconductor wellregions 28. The pixel transistors Tr are formed by the source region andthe drain region, the gate insulating film, and the gate electrode 29,respectively. Further, the multilayer interconnection layers 33 in whicha plurality of layers of interconnections 32 is disposed through theinterlayer insulating film 31 are formed on the substrate surface 22A.

Next, as shown in FIG. 15A, the insulation film, or the antireflectionfilm 36 in the example is formed on the substrate backside 22B used as alight receiving surface, and the insulation film 52 is formed on thisantireflection film 36. The light-shielding film material layer 39A isformed on this insulating film 52. The insulating film 52 may be formedby, for example, a silicon oxide (SiO₂) film. A film thickness of theinsulating film 52 is selected to be sufficiently thicker than a filmthickness of the antireflection film 36. The antireflection film 36 isformed by a plurality of layers having a different refractive index, andis formed by a two-layer film in which the silicon oxide (SiO₂) film 37and the hafnium oxide (HfO₂) film 38 are stacked from the substratebackside 22B side in the example. The silicon oxide film 37 and hafniumoxide film 38 are each formed with a film thickness optimal forantireflection. The light-shielding film material layer 39A is formed bymaterials excellent in light-shielding property and workability, such asaluminum (Al) or tungsten (W).

Next, a resist mask 47 is selectively formed on the light-shielding filmmaterial layer 39A. The resist mask 47 includes an aperture in a portioncorresponding to the photodiode PD, and is formed in a lattice shapewhen seen in a plan view in order for portions corresponding to each ofthe pixel boundaries to remain. As shown in FIG. 15B, thelight-shielding film material layer 39A is selectively etched andremoved through the resist mask 47, to thereby form the light-shieldingfilm 39 in each of the pixel boundaries. The etching may use wet etchingor dry etching. It is preferable to use dry etching since a fine linewidth of the light-shielding film 39 is obtained with good accuracy. Atthe time of selective etching of this light-shielding film materiallayer 39A, even though an underlying layer receives an etching damage,there is no damage received by the insulating film 52.

Next, as shown in FIG. 16A, the planarization film 41 is formed on theantireflection film including the light-shielding film 39. Thisplanarization film 41 is formed by applying organic materials such as,for example, resin.

Next, as shown in FIG. 16B, the on-chip color filter 42 and the on-chipmicrolens 43 of, for example, Bayer array are sequentially formed on theplanarization film 41. In this manner, the solid-state imaging device 51according to a purpose of the second embodiment is obtained.

With a method of manufacturing the solid-state imaging device accordingto the embodiment, after the insulating film 52 of which a filmthickness sufficiently thicker than that of the antireflection film 36is formed on the antireflection film 36, the light-shielding film 39 isformed at the portion of the pixel boundary on the insulating film 52.For this reason, at the time of selective processing by etching of thelight-shielding film 39, even though an etching damage is given to anunderlying film, it is possible to form the antireflection film 36having an optimal film thickness without any etching damage on theantireflection film 36.

Furthermore, the same effect is exhibited as described in the method ofmanufacturing the solid-state imaging device according to the firstembodiment. That is, the light-shielding film 39 is selectively formedin a portion corresponding to the pixel boundary through theantireflection film 36 and the insulating film 52 on the backside 22Bused as a light receiving surface of the semiconductor substrate 22, tothereby allow the light-shielding film 39 to be formed in a positionclose to the light receiving surface 34. The light-shielding film 39 isformed in a position close to the light receiving surface, whereby it ispossible to prevent the light which is not collected by the on-chipmicrolens 43 from entering the adjacent pixel. In addition, thislight-shielding film 39 prevents the incidence of the diffracted lightwhich causes generation of Mg flare on the effective pixel. Since theon-chip color filters 42 and the on-chip microlenses 43 are formedthrough the planarization film 41, the lens heights of the on-chipmicrolenses 43 can be made uniform within the effective screen region.

Further, in the manufacturing method according to the embodiment, sincethe antireflection film 36 maintaining an optimal film thickness on thelight receiving surface 34 is formed, reflection from the lightreceiving surface 34 of the substrate backside 22B is furthersuppressed, and high sensitivity is achieved. Therefore, themanufacturing method can reduce the optical color mixing, reduce Mgflare by suppressing the incidence of the diffracted light on theeffective pixel, and manufacture the solid-state imaging deviceaccording to the higher-performance second embodiment which achievesuniformity and high sensitivity within the effective pixel region, withease and a high degree of accuracy.

In the solid-state imaging device 21 and 51 according to theabove-mentioned embodiment, it is possible to appropriately select anaperture shape of the light-shielding film 39 in accordance with alight-collecting state. FIGS. 17A to 17C show examples of the apertureshapes of the light-shielding film 39. The light-shielding film 39 shownin FIG. 17A includes a quadrangular aperture 39 a as the aperture shape.Therefore, the shape of the light receiving surface of the photodiode PDis quadrangular. When the aperture 39 a is quadrangular, the maximumsensitivity is obtained.

The light-shielding film 39 shown in FIG. 17B is configured to have theaperture 39 b formed of polygon, and octagon in the example as anaperture shape. Therefore, the shape of the light receiving surface ofthe photodiode PD is octagonal. When the aperture 39 b is octagonal, itis possible to reduce flare in a diagonal direction compared to thequadrangular shape.

The light-shielding film 39 shown in FIG. 17C is configured to have theaperture 39 c formed of circle as an aperture shape. Therefore, theshape of the light receiving surface of the photodiode PD is circular.When the aperture 39 c is circular (inscribed circle of a quadrangularshape in FIG. 17A), it is also possible to reduce flare generated in animmediate direction of horizon and diagonal. However, the sensitivity islowest among FIG. 17A to FIG. 17C.

In any of the configurations of FIGS. 17A to 17C, the light-shieldingfilm 39 of the pixel boundary is formed so that a center O of thephotodiode PD and a center O of the light-shielding film aperture formedin the semiconductor substrate 22 are matched with each other with adiphycercally and bilaterally symmetric shape. It is possible tomaintain incidence angle-dependent symmetric properties and to obtainisotropic sensitivity characteristics in the whole screen by matchingthe center of the photodiode PD and the center of the light-shieldingfilm aperture with each other.

4. Third Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 18 shows the third embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device.The solid-state imaging device 56 according to the third embodiment isconstituted so that each of the photodiodes PD is formed in the pixelregion 23 of the semiconductor substrate 22, a logic circuit (not shown)is formed in the peripheral circuit section 57, and the antireflectionfilm 36 and the insulating film 52 are formed on the backside 22B of thesemiconductor substrate 22 in order.

In the embodiment, the lattice-shaped light-shielding film 39 in thepixel boundary is formed on the insulating film 52 corresponding to thepixel region 23, and the consecutive light-shielding film 39 is formedon the insulating film 52 corresponding to the peripheral circuitsection 57 and an optical black level region 23B of the pixel region.The optical black level region 23B is formed in the circumference of theeffective pixel region 23A. The light-shielding film 39 of the pixelboundary, and the consecutive light-shielding film 39 reaching theperipheral circuit 57 and the optical black level region 23B aresimultaneously formed by the same material films. The light-shieldingfilm 39 in the pixel boundary, and the light-shielding film 39 reachingthe peripheral circuit 57 and the optical black level region 23B areconsecutively integrally formed with each other.

In the embodiment, the planarization film 41 is further formed on theinsulating film 52 including the light-shielding films 39 and 39, andthe on-chip color filter 42 and the on-chip microlens 43 are formed on aregion corresponding to the pixel region 23 of the planarization film41. The multilayer interconnection layer, in which a plurality of layersof interconnections is disposed in the substrate surface side throughthe interlayer insulating film, is formed even in the peripheral circuitsection 57.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14, and the description thereof is omitted.

With the solid-state imaging device 56 according to the thirdembodiment, the light-shielding film 39 consecutive from the peripheralcircuit section 57 to the optical black level region 23B, and thelattice-shaped light-shielding film 39 in the pixel boundary aresimultaneously formed, to thereby reduce level difference caused by thelight-shielding film 39. Herewith, the on-chip microlenses 43 can be ofthe uniform lens height within the effective pixel region, and theuniform light-collecting state is obtained in the whole effective pixel.

Furthermore, the same effect is exhibited as described in the secondembodiment, where optical color mixing in the adjacent pixel by thelight which is not collected by the on-chip microlens 43 is reduced, andthe incidence of the diffracted light on the effective pixel issuppressed to thereby reduce generation of Mg flare, and the like. Thus,the back-illuminated solid-state imaging device 56 according the thirdembodiment can achieve improvement in image quality.

5. Fourth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 19 shows the fourth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device59 according to the fourth embodiment is constituted so that each of thephotodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, a logic circuit (not shown) is formed in the peripheralcircuit section 57, and the antireflection film 36 and the insulatingfilm 52 are formed on the backside 22B of the semiconductor substrate 22in order.

The lattice-shaped light-shielding film 39 is formed, corresponding tothe pixel boundary, on the insulating film 52 corresponding to the pixelregion 23, and the consecutive light-shielding film 39 is formed on theinsulating film 52 corresponding to the peripheral circuit section 57and an optical black level region 23B of the pixel region. The opticalblack level region 23B is formed in the circumference of the effectivepixel region 23A. The light-shielding film 39 of the pixel boundary andthe consecutive light-shielding film 39 reaching the peripheral circuit57 and the optical black level region 23B are simultaneously formed bythe same material films. The light-shielding film 39 in the pixelboundary and the light-shielding film 39 reaching the peripheral circuit57 and the optical black level region 23B are consecutively integrallyformed with each other.

In the embodiment, the above-mentioned light-shielding film 39 isconnected to a ground (GND) region of the semiconductor substrate 22,that is, the element isolation region 27 made of a p-type semiconductorregion. As mentioned above, the light-shielding film 39 is formed by,for example, aluminum (Al) or tungsten (W). It is preferable that thelight-shielding film 27 is connected to the p-type semiconductor regionof the element isolation region 27 through a barrier metal layer 60 suchas, for example, Ti and TiN, as shown in FIG. 19. A ground potential isapplied to the light-shielding film 39 through the p-type semiconductorregion of the element isolation region 27.

As shown in FIG. 20, the light-shielding film 39 is connected to theelement isolation region 27 locating the outside from the optical blacklevel region 23B of the pixel region through a contact portion 61. Inaddition, the light-shielding film 39 may be connected to a contactportion 62 of the element isolation region 27 in the effective pixelregion 23A. In the pixel region 23, since damage is given to the silicondue to formation of the contact portion 61, and there may be apossibility that white spot generation occurs, the contact portion 61has to be formed. Therefore, it is preferable that connection of thelight-shielding film 39 to the element isolation region is performed atthe outside of the optical black level region.

Furthermore, the configuration is the same as described in the secondembodiment and the third embodiment, therefore the same numerals andsigns are attached to the parts corresponding to FIG. 14 and FIG. 18 andthe description thereof is omitted.

With the solid-state imaging device 59 according to the fourthembodiment, the light-shielding film 39 is grounded through the elementisolation region 27 which is a ground region, so that a potential of thelight-shielding film 39 is fixed, dark noise can be reduced withouthaving an adverse influence on the below photodiode PD.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41, and the like. Inaddition, the same effect is exhibited as described in the thirdembodiment, such as reduction of level difference by the light-shieldingfilm 39, and obtainment of the uniform light-collecting state in thewhole effective pixel. Thus, the back-illuminated solid-state imagingdevice 59 according to the fourth embodiment can achieve improvement inimage quality.

6. Fifth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 21 shows the fifth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device63 according to the fifth embodiment is constituted so that each of thephotodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, and a logic circuit is formed in the peripheral circuitsection (not shown). Each of the pixel composed of the photodiode PD andthe pixel transistor is isolated by the element isolation region 27. Theantireflection film 36 and the insulating film 52 are formed on thesubstrate backside 22B used as a light receiving surface of thephotodiode PD, and the lattice-shaped light-shielding film 39 is formedin the pixel boundary on the insulating film 52.

In the embodiment, an intralayer lens 64 is formed in the upper portionto which each photodiode PD corresponds. The intralayer lens 64 may beformed by, for example, a nitride film as the intralayer lens 64 whichis configured to be form a convex lens in the example.

A planarization film 67 made of, for example, an organic film is formedon the intralayer lens 64, and the on-chip color filter 42 and theon-chip microlens 43 are sequentially formed on this planarization film67. The intralayer lens 64 according to the embodiment is formedbetween, so to speak, a lower layer of the on-chip color filter 42, thatis, antireflection film 36 and the on-chip color filter 42.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 63 according to the fifthembodiment, since the intralayer lens 64 is formed corresponding to theeach photodiode PD between the antireflection film 36 and the on-chipcolor filter 42, light-collecting efficiency in the photodiode PD isfurther improved. Herewith, optical color mixing in the adjacent pixelcan be further reduced.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41. Thus, theback-illuminated solid-state imaging device 63 according to the fifthembodiment can achieve improvement in image quality.

7. Sixth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 22 shows the sixth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device67 according to the sixth embodiment is constituted so that each of thephotodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, and a logic circuit is formed in the peripheral circuitsection (not shown). Each of the pixel composed of the photodiode PD andthe pixel transistor is isolated by the element isolation region 27. Theantireflection film 36 and the insulating film 52 are formed on thesubstrate backside 22B used as a light receiving surface of thephotodiode PD, and the lattice-shaped light-shielding film 39 is formedin the pixel boundary on the insulating film 52. Further, the on-chipcolor filter 42 and the on-chip microlens 43 are formed on theinsulating film 52 including the light-shielding film 39 through theplanarization film 41.

In the embodiment, the antireflection film 68 is formed on the surfaceof each on-chip microlens 43 so as to be along the lens surface. It ispossible to be formed by one layer of, for example, a silicon oxide filmas this antireflection film 68. It is also possible to be formed by theother plural layer films as the antireflection film 68.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 67 according to the sixthembodiment, it is possible to reduce reflectance caused by the on-chipmicrolens 43 and the on-chip color filter 42 when photographing using ahigh-intensity light source by forming the antireflection film 68 in thesurface of the on-chip microlens 43. Therefore, it is possible tofurther reduce the incidence of the diffracted light on the effectivepixel and to further reduce Mg flare.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41. Thus, theback-illuminated solid-state imaging device 67 according to the sixthembodiment can achieve improvement in image quality.

8. Seventh Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 23 shows the seventh embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device71 according to the seventh embodiment is constituted so that each ofthe photodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, and a logic circuit is formed in the peripheral circuitsection (not shown). Each of the pixel composed of the photodiode PD andthe pixel transistor is isolated by the element isolation region 27. Theantireflection film 36 and the insulating film 52 are formed on thesubstrate backside 22B used as a light receiving surface of thephotodiode PD, and the lattice-shaped light-shielding film 39 is formedin the pixel boundary on the insulating film 52. Further, the on-chipcolor filter 42 and the on-chip microlens 43 are formed on theinsulating film 52 including the light-shielding film 39 through theplanarization film 41.

In the embodiment, a transparent planarization film 72 which isuniformly and continuously formed on the on-chip microlens 43. Thisplanarization film 72 is formed by a material film having a lowerrefractive index than that of the on-chip microlens 43, for example, anorganic film such as resin.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 71 according to the seventhembodiment, since the planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 43, it is possible toreduce reflectance caused by the on-chip microlens 43 and the on-chipcolor filter 42 when photographing using a high-intensity light source.Therefore, it is possible to suppress the incidence of the diffractedlight on the effective pixel and to further reduce Mg flare.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41. Thus, theback-illuminated solid-state imaging device 71 according to the seventhembodiment can achieve improvement in image quality.

9. Eighth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 24 shows the eighth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device74 according to the eighth embodiment is constituted so that each of thephotodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, and a logic circuit is formed in the peripheral circuitsection (not shown). Each of the pixel composed of the photodiode PD andthe pixel transistor is isolated by the element isolation region 27. Theantireflection film 36 and the insulating film 52 are formed on thesubstrate backside 22B used as a light receiving surface of thephotodiode PD, and the lattice-shaped light-shielding film 39 is formedin the pixel boundary on the insulating film 52. Further, the on-chipcolor filter 42 and an on-chip microlens 75 are formed on the insulatingfilm 52 including the light-shielding film 39 through the planarizationfilm 41.

In the embodiment, the on-chip microlens 75 is formed by a rectangularlens, and the transparent planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 75. This planarization film72 is formed by a material film having a lower refractive index thanthat of the on-chip microlens 43, for example, an organic film such asresin.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 74 according to the eighthembodiment, since the planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 75, it is possible toreduce reflectance caused by the on-chip microlens 75 and the on-chipcolor filter 42 when photographing using a high-intensity light source.Therefore, it is possible to suppress the incidence of the diffractedlight on the effective pixel and to further reduce Mg flare. Inaddition, since the on-chip microlens 75 is formed by a rectangularlens, it is possible to make a lens height higher, and to improve alight-collecting capacity of the on-chip microlens to a large extent.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41. Thus, theback-illuminated solid-state imaging device 74 according to the eighthembodiment can achieve improvement in image quality.

10. Ninth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 25 shows the ninth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device77 according to the ninth embodiment is constituted so that each of thephotodiodes PD is formed in the pixel region 23 of the semiconductorsubstrate 22, and a logic circuit is formed in the peripheral circuitsection (not shown). Each of the pixel composed of the photodiode PD andthe pixel transistor is isolated by the element isolation region 27. Theantireflection film 36 and the insulating film 52 are formed on thesubstrate backside 22B used as a light receiving surface of thephotodiode PD, and the lattice-shaped light-shielding film 39 is formedin the pixel boundary on the insulating film 52.

In the embodiment, the planarization film 41 is omitted, the on-chipcolor filter 42 is formed directly on the antireflection film 36including the light-shielding film 39, and the on-chip microlens 43 isformed thereon. A portion of each of the color filters of the on-chipcolor filter 42 is formed between the light-shielding films 39.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 77 according to the ninthembodiment, since the on-chip color filter 42 is formed directly on theantireflection film 36 including the light-shielding film 39, thesensitivity is increased, and optical color mixing and Mg flare arereduced.

Furthermore, the same effect is exhibited as described in the secondembodiment, such as reduction of optical color mixing in the adjacentpixel by the light-shielding film 39 of the pixel boundary, reduction ofgeneration of Mg flare by suppression of the incidence of the diffractedlight on the effective pixel, and uniform sensitivity within theeffective pixel region by the planarization film 41. Thus, theback-illuminated solid-state imaging device 77 according to the ninthembodiment can achieve improvement in image quality.

11. Tenth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 26 shows the tenth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device79 according to the tenth embodiment is equal to the configuration wherethe light-shielding film 39 of the pixel boundary is omitted in theabove-mentioned sixth embodiment (see FIG. 22). Meanwhile, theperipheral circuit section and the optical black level region areshielded from light—as in the example of the related art.

That is, the solid-state imaging device 79 according to the embodimentis constituted so that each of the photodiodes PD is formed in the pixelregion 23 of the semiconductor substrate 22, and a logic circuit isformed in the peripheral circuit section (not shown). Each pixelcomposed of the photodiode PD and the pixel transistor is isolated bythe element isolation region 27. The antireflection film 36 and theinsulating film 52 are formed on the substrate backside 22B used as alight receiving surface of the photodiode PD. The on-chip color filter42 and the on-chip microlens 43 are formed on the insulating film 52through the planarization film 41.

Further, in the embodiment, the antireflection film 68 is formed on thesurface of each on-chip microlens 43 so as to be along the lens surface.It is possible to be formed by one layer of, for example, a siliconoxide film as this antireflection film 68. It is also possible to beformed by the other plural layer films as the antireflection film 68.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 79 according to the tenthembodiment, it is possible to reduce reflectance caused by the on-chipmicrolens 43 and the on-chip color filter 42 when photographing using ahigh-intensity light source by forming the antireflection film 68 in thesurface of the on-chip microlens 43. Therefore, it is possible tofurther reduce the incidence of the diffracted light on the effectivepixel and to further reduce Mg flare. Thus, the back-illuminatedsolid-state imaging device 79 according to the tenth embodiment canachieve improvement in image quality.

12. Eleventh Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 27 shows the eleventh embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device81 according to the eleventh embodiment is equal to the configurationwhere the light-shielding film 39 of the pixel boundary is omitted inthe above-mentioned seventh embodiment (see FIG. 23). Meanwhile, theperipheral circuit section and the optical black level region areshielded from light as in the example of the related art.

That is, the solid-state imaging device 81 according to the embodimentis constituted so that each of the photodiodes PD is formed in the pixelregion 23 of the semiconductor substrate 22, and a logic circuit isformed in the peripheral circuit section (not shown). Each pixelcomposed of the photodiode PD and the pixel transistor is isolated bythe element isolation region 27. The antireflection film 36 and theinsulating film 52 are formed on the substrate backside 22B used as alight receiving surface of the photodiode PD. The on-chip color filter42 and the on-chip microlens 43 are formed on the insulating film 52through the planarization film 41.

In the embodiment, the transparent planarization film 72 which isuniformly and continuously formed on the on-chip microlens 43. Thisplanarization film 72 is formed by a material film having a lowerrefractive index than that of the on-chip microlens 43, for example, anorganic film such as resin.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 81 according to the eleventhembodiment, since the planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 43, it is possible toreduce reflectance caused by the on-chip microlens 43 and the on-chipcolor filter 42 when photographing using a high-intensity light source.Therefore, it is possible to suppress the incidence of the diffractedlight on the effective pixel and to further reduce Mg flare.

Thus, the back-illuminated solid-state imaging device 81 according tothe eleventh embodiment can achieve improvement in image quality.

13. Twelfth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 28 shows the twelfth embodiment of the solid-state imaging deviceaccording to the invention. The solid-state imaging device according tothe embodiment is a back-illuminated CMOS solid-state imaging device. Inthe same drawing, a portion of the substrate surface sides is omittedand the only partial cross-sectional structure is shown. The omittedparts are the same as those of FIG. 14. The solid-state imaging device83 according to the twelfth embodiment is equal to the configurationwhere the light-shielding film 39 of the pixel boundary is omitted inthe above-mentioned eighth embodiment (see FIG. 24). Meanwhile, theperipheral circuit section and the optical black level region areshielded from light as in the example of the related art.

That is, the solid-state imaging device 81 according to the embodimentis constituted so that each of the photodiodes PD is formed in the pixelregion 23 of the semiconductor substrate 22, and a logic circuit isformed in the peripheral circuit section (not shown). Each pixelcomposed of the photodiode PD and the pixel transistor is isolated bythe element isolation region 27. The antireflection film 36 and theinsulating film 52 are formed on the substrate backside 22B used as alight receiving surface of the photodiode PD. The on-chip color filter42 and the on-chip microlens 75 are formed on the insulating film 52through the planarization film 41.

In the embodiment, the on-chip microlens 75 is formed by a rectangularlens, and the transparent planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 75. This planarization film72 is formed by a material film having a lower refractive index thanthat of the on-chip microlens 43, for example, an organic film such asresin.

Furthermore, the configuration is the same as described in the secondembodiment, therefore the same numerals and signs are attached to theparts corresponding to FIG. 14 and the description thereof is omitted.

With the solid-state imaging device 83 according to the twelfthembodiment, since the planarization film 72 which is uniformly andcontinuously formed on the on-chip microlens 75, it is possible toreduce reflectance caused by the on-chip microlens 75 and the on-chipcolor filter 42 when photographing using a high-intensity light source.Therefore, it is possible to suppress the incidence of the diffractedlight on the effective pixel and to further reduce Mg flare. Inaddition, since the on-chip microlens 75 is formed by a rectangularlens, it is possible to make a lens height higher, and to improve alight-collecting capacity of the on-chip microlens to a large extent.Thus, the back-illuminated solid-state imaging device 74 according tothe twelfth embodiment can achieve improvement in image quality.

In the third embodiment to the twelfth embodiment, it is also possibleto form the configurations where the insulating film 52 is omittedsimilar to the first embodiment. In addition, it is also possible toform the configurations where the characteristic configurations in thefirst embodiment to the twelfth embodiment are combined with each other.

14. Thirteenth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 29 shows the thirteenth embodiment of the solid-state imagingdevice according to the invention. The solid-state imaging deviceaccording to the embodiment is a back-illuminated CMOS solid-stateimaging device. The solid-state imaging device 85 according to thethirteenth embodiment forms, for example, a pixel region (so-calledimage capturing region) 23 in which a plurality of pixels is arranged ina semiconductor substrate 22 made of silicon, and a peripheral circuitsection (not shown) disposed in a periphery of the pixel region 23. Aunit pixel 24 is constituted by a photodiode PD used as a photoelectricconversion section and a plurality of pixel transistors Tr. Thephotodiode PD is formed so as to extend over the whole region in athickness direction of the semiconductor substrate 22, and is configuredas a p-n junction type photodiode composed of a first conductivity type,which is an n-type semiconductor region 25 in the example, and a secondconductivity type facing both sides of the substrate, which is a p-typesemiconductor region 26 in the example. The p-type semiconductor regionfacing both sides of the substrate further includes a hole chargeaccumulation region for suppressing dark current.

Each of the pixels 24 composed of the photodiode PD and the pixeltransistor Tr is isolated by an element isolation region 27. The elementisolation region 27 is formed and, for example, grounded by the p-typesemiconductor region. The pixel transistor Tr forms a n-type sourceregion and a drain region, which are not shown, in a p-typesemiconductor well region 28 formed on a surface 22A side of thesemiconductor substrate 22, and forms a gate electrode 29 on thesubstrate surface between both regions through a gate insulating film.In the same drawing, a plurality of pixel transistors is shown asrepresented by one pixel transistor Tr, and is schematically indicatedby the gate electrode 29.

In the embodiment, an insulating film is formed on the surface 22A usedas a light receiving surface of the semiconductor substrate 22 in whichthe pixel transistor Tr is formed, through the planarization film 86made of an insulating film such as, for example, a silicon oxide film.This insulating layer is formed by an antireflection film 36 in theexample. The antireflection film 36 is formed by a multilayer filmhaving a different refractive index, and is formed by a two-layer filmmade of the hafnium oxide (HfO₂) film 37 and the silicon oxide film 38in the example.

Further, the light-shielding film 39 is formed at a pixel boundary onthis antireflection film 36. As mentioned above, this light-shieldingfilm 39 may be a light-shielding material. Meanwhile, it is preferableto form the light-shielding film with a film of metal, for example,aluminum (Al) or tungsten (W) as a material which has stronglight-shielding properties, and is capable of being processed with goodaccuracy using microfabrication, for example, etching. Thelight-shielding film 38 may be formed by, for example, poly-silicon.

So-called multilayer interconnection layers 33 in which a plurality oflayers of interconnections 32 is disposed through the interlayerinsulating film 31 are formed on the antireflection film 36 includingthe light-shielding film 39. The on-chip color filter 42 and the on-chipmicrolens 43 thereon are sequentially formed on the multilayerinterconnection layer 33 through the planarization film 86. The light Lenters from the substrate surface 22A, and is collected by the on-chipmicrolens 43 and then received in each of the photodiodes PD.

With the back-illuminated solid-state imaging device 85 according to thethirteenth embodiment, since the light-shielding film 39 is formed inthe pixel boundary very close to the light receiving surface 34, lighttravelling to an adjacent pixel is shielded without being collected bythe on-chip microlens 43. That is, it is possible to prevent the lightfrom being incident on the adjacent pixel by the light-shielding film 39of the pixel boundary, and to reduce optical color mixing. Thus, thesolid-state imaging device 85 according to the thirteenth embodiment canimprove image quality.

15. Fourteenth Embodiment

Configuration Example of Solid-State Imaging Device

FIG. 30 shows the fourteenth embodiment of the solid-state imagingdevice according to the invention. The solid-state imaging deviceaccording to the embodiment is a back-illuminated CMOS solid-stateimaging device. Similar to the thirteenth embodiment, the solid-stateimaging device 89 according to the fourteenth embodiment forms, forexample, a pixel region (so-called image capturing region) 23 in which aplurality of pixels is arranged in a semiconductor substrate 22 made ofsilicon, and a peripheral circuit section (not shown) disposed in aperiphery of the pixel region 23. A logic circuit is formed in theperipheral circuit section. A unit pixel 24 is constituted by aphotodiode PD used as a photoelectric conversion section and a pluralityof pixel transistors Tr. The photodiode PD is formed so as to extendover the whole region in a thickness direction of the semiconductorsubstrate 22, and is configured as a p-n junction type photodiodecomposed of a first conductivity type, which is an n-type semiconductorregion 25 in the example, and a second conductivity type facing bothsides of the substrate, which is a p-type semiconductor region 26 in theexample. The p-type semiconductor region facing both sides of thesubstrate further includes a hole charge accumulation region forsuppressing dark current.

Each of the pixels 24 composed of the photodiode PD and the pixeltransistor Tr is isolated by an element isolation region 27. The elementisolation region 27 is formed and, for example, grounded by the p-typesemiconductor region. The pixel transistor Tr forms a n-type sourceregion and a drain region, which are not shown, in a p-typesemiconductor well region 28 formed on a surface 22A side of thesemiconductor substrate 22, and forms a gate electrode 29 on thesubstrate surface between both regions through a gate insulating film.In the same drawing, a plurality of pixel transistors is shown asrepresented by one pixel transistor Tr, and is schematically indicatedby the gate electrode 29.

In the embodiment, an insulating film is formed on the surface 22A usedas a light receiving surface of the semiconductor substrate 22 in whichthe pixel transistor Tr is formed, through the planarization film 86made of an insulating film such as, for example, a silicon oxide film.This insulating layer is formed by an antireflection film 36 in theexample. The antireflection film 36 is formed by a multilayer filmhaving a different refractive index, and is formed by a two-layer filmmade of the hafnium oxide (HfO₂) film 37 and the silicon oxide film 38in the example.

Further, in the embodiment, the insulating film 52 is formed on thisantireflection film 36, and a light-shielding film 39 is formed at thepixel boundary on this insulating film 52. The insulating film 52 is setup so as for a film type and a film thickness thereof to be an opticallyappropriate value. The insulating film 52 may be formed by, for example,a silicon oxide film, and is set up so as for film thickness thereof tobe sufficiently thicker than at least a film thickness of theantireflection film 36. The light-shielding film 39 may be alight-shielding material. Meanwhile, it is preferable to form thelight-shielding film with a film of metal, for example, aluminum (Al) ortungsten (W) as a material which has strong light-shielding properties,and is capable of being processed with good accuracy usingmicrofabrication, for example, etching. The light-shielding film 39 maybe also formed by, for example, poly-silicon.

So-called multilayer interconnection layers 33 in which a plurality oflayers of interconnections 32 is disposed through the interlayerinsulating film 31 are formed on the insulating film 52 including thelight-shielding film 39. The on-chip color filter 42 and the on-chipmicrolens 43 thereon are sequentially formed on the multilayerinterconnection layer 33 through the planarization film 86. The light Lenters from the substrate surface 22A, and is collected by the on-chipmicrolens 43 and then received in each of the photodiodes PD.

With the back-illuminated solid-state imaging device 89 according to thefourteenth embodiment, the insulating film 52 of which film thickness isthicker than that of the antireflection film 36 is formed on theantireflection film 39, and the light-shielding film 36 is formed at aportion corresponding to the pixel boundary on this insulating film 52,therefore the optimal antireflection film 36 is maintained. That is,formation of the light-shielding film 36 is patterned by selectiveetching, after the light-shielding film material layer is formed in thewhole surface. In this selective etching, even though an underlyinglayer receives an etching damage, the damage received by the insulatingfilm 52, therefore the antireflection film 36 is not affected at all.

Similar to the thirteenth embodiment, since the light-shielding film 39is formed in the pixel boundary very close to the light receivingsurface 87, light travelling to an adjacent pixel is shielded withoutbeing collected by the on-chip microlens 43. That is, it is possible toprevent the light from being incident on the adjacent pixel by thelight-shielding film 39 of the pixel boundary, and to reduce opticalcolor mixing. Thus, the solid-state imaging device 85 according to thefourteenth embodiment can improve an image quality.

In the solid-state imaging device according to the embodiment describedabove, the first conductivity type is set to an n type and the secondconductivity type is set to a p type, using the signal charge as anelectron. However, when the signal charge is used as a hole, the firstconductivity type may be set to a p type and the second conductivitytype may be set to an n type. In this case, the conductivity typesemiconductor region according to the embodiment described above becomesa reverse conductivity type.

16. Fifteenth Embodiment

Configuration Example of Electronic Apparatus

The solid-state imaging devices according to the invention describedabove can be applied to electronic apparatuses such as, for example,camera systems of a digital camera or a video camera and like, cellularphones having an image capturing function, or other apparatuses havingan image capturing function.

FIG. 43 shows the third embodiment applied to a camera as an example ofthe electronic apparatus according to the invention. The cameraaccording to examples of the embodiments includes a video camera capableof photographing a still image or a moving image as an example. Thecamera according to examples of the embodiments includes a solid-stateimaging device 1, an optical system 210 for leading incident light to alight-receiving sensor portion of the solid-state imaging device 1, ashutter device 211, a drive circuit 212 for driving the solid-stateimaging device 1, and a signal processing circuit 213 for processing anoutput signal of the solid-state imaging device 1.

The solid-state imaging device 1 is applied to any of the solid-stateimaging devices according to each embodiment described above. Theoptical system (optical lens) 210 images an image light (incident light)from a photographic subject on an image capturing surface of thesolid-state imaging device 1. Herewith, signal charges are accumulatedwithin the solid-state imaging device 1 for a certain period of time.The optical system 210 may be an optical lens system constituted by aplurality of optical lenses. The shutter device 211 controls a period oflight illumination and a period of light shielding to the solid-stateimaging device 1. The drive circuit 212 supplies a driving signal forcontrolling a transfer operation of the solid-state imaging device 1 anda shutter operation of the shutter device 211. The signal transfer inthe solid-state imaging device 1 is performed by the driving signal(timing signal) supplied from the drive circuit 212. The signalprocessing circuit 213 is performed various types of signal processing.The image signal which the signal processing has performed is stored ina storage medium such as a memory, or is output to a monitor.

With the electronic apparatus according to the fourth embodiment, thesolid-state imaging device according to the above-mentioned embodimentsis used as the solid-state imaging device 1, to thereby allowimprovement in image quality to be achieved, and to allow an electronicapparatus such as a camera having a higher reliability to be provided.

17. Sixteenth Embodiment: Solid-State Imaging Device

17.1 Configuration of the Whole Solid-State Imaging device

FIG. 7 is a schematic configuration diagram illustrating the whole CMOStype solid-state imaging device according to the sixteenth embodiment ofthe invention.

The solid-state imaging devices or the electronic apparatuses associatedwith the first embodiment to fifteenth embodiment may be usedsimultaneously with the solid-state imaging devices or the electronicapparatuses associated with the sixteenth embodiment to eighteenthembodiment.

The solid-state imaging device 1 includes, a pixel 2, a pixel section 3,a vertical drive circuit 4, a column signal processing circuit 5, ahorizontal drive circuit 6, an output circuit 7, a control circuit 8, ahorizontal signal 10, a pixel forming region 512, a substrate 513, asupport substrate 514, an interconnection layer 515, an on-chip lens516, a light-shielding portion 517, a high-dielectric material film 518,a trench portion 519, a light-shielding film 520, a charge accumulationregion 521, a dark current suppression region 522, a dark currentsuppression region 523, an element isolation region 524, aninterconnection 525, an interconnection layer 526, an interlayerinsulating film 527, a gate electrode 528, a gate insulating film 529, abackside region 530, a silicon layer 530 a, an etching stopper layer 530b, a photoresist layer 531, an aperture portion 531 a, and a buryingfilm 532.

The solid-state imaging device 1 according to the example of theembodiment includes the pixel section 3 constituted by a plurality ofpixels 2 which is arranged on the substrate 11 made of silicon, thevertical drive circuit 4, the column signal processing circuit 5, thehorizontal drive circuit 6, the output circuit 7, and control circuit 8.

A plurality of pixels 2 is constituted by the light-receiving portioncomposed of the photodiodes, and a plurality of pixel transistors, andis regularly arranged on the substrate 11 in a two-dimensional arrayshape. The pixel transistors constituting the pixel 2 may be four MOStransistors which are composed of a transfer transistor, a resettransistor, a selective transistor, an amplifying transistor, and mayalso be three transistors excluding the selective transistor.

The pixel section 3 is constituted by a plurality of pixels 2 which isregularly arranged in a two-dimensional array shape. The pixel section 3is constituted by an effective pixel region in which light is actuallyreceived and a signal charge generated by photoelectric conversion isamplified and thereby reads out the signal charge in the column signalprocessing circuit 5, a black reference pixel region (not shown) foroutputting optical black which is a reference of black level. The blackreference pixel region is typically formed at a circumference portion ofthe effective pixel region.

The control circuit 8 generates a clock signal or a control signal andthe like which is a reference of operation of the vertical drive circuit4, the column signal processing circuit 5, the horizontal drive circuit6 and the like on the basis of a vertical synchronization signal, ahorizontal synchronization signal and a master clock. The clock signalor the control signal and the like generated by the control circuit 8are input to the vertical drive circuit 4, the column signal processingcircuit 5, horizontal drive circuit 6 and the like.

The vertical drive circuit 4 is constituted by, for example, shiftregisters, and sequentially selectively scans each pixel 2 of the pixelsection 3 in a vertical direction in a row unit. A pixel signal, whichis based on the signal charge generated in response to the amount oflight received in the photodiodes of each pixel 2, is supplied to thecolumn signal processing circuit 5 through a vertical signal line.

The column signal processing circuit 5, for example, is disposed foreach column of the pixel 2, and performs the signal processing such asdenoising or signal amplification by the signal from the black referencepixel region (not shown, and formed at the periphery of the effectivepixel region) processing a signal output from one line of the pixels 2for each pixel column. An output stage of the column signal processingcircuit 5 is provided with a horizontal selective switch (not shown)between the horizontal signal line 10 and the output stage.

The horizontal drive circuit 6, for example, is constituted by the shiftregisters, and sequentially outputs horizontal scan pulses, to therebyselect each of the column signal processing circuits 5 in order, and tooutput the pixel signal from each of the column signal processingcircuits 5 to the horizontal signal line 10.

The output circuit 7 performs the signal processing on the signalsequentially supplied from each of the column signal processing circuits5 through the horizontal signal line 10 and outputs the signal.

17.2 Partial Configuration

FIG. 31 shows a cross-sectional configuration diagram in the pixelsection 3 of the solid-state imaging device 1 according to the exampleof the embodiment. The solid-state imaging device 1 according to theexample of the embodiment includes a back-illuminated CMOS solid-stateimaging device as an example.

As shown in FIG. 31, the solid-state imaging device 1 according to theexample of the embodiment is constituted by a substrate 513, aninterconnection layer 526 and a support substrate 514 formed at thesurface side of the substrate 513, and a color filter layer 515 and anon-chip lens 516 formed at the backside of the substrate 513.

The substrate 513 is constituted by the semiconductor substrate made ofsilicon, and is constituted by the semiconductor substrate of, forexample, the first conductivity type (n type in the example of theembodiment). The substrate 513 has a thickness of 3 μm to 5 μm. Aplurality of the pixels 2 composed of the light-receiving portion PD,and a plurality of pixel transistors Tr constituting the pixel circuitsection is formed in the pixel forming region 512 of the substrate 513in a two-dimensional matrix shape. In addition, although not shown inFIG. 31, the peripheral circuit section is formed in the peripheralregion of the pixel 2 formed in the substrate 513.

The light-receiving portion PD is constituted by dark currentsuppression regions 522 and 523 formed in the pixel forming region 512,and a charge accumulation region 521 formed in a region between the darkcurrent suppression regions 522 and 523. The dark current suppressionregion 523 is formed in the surface side of the substrate 513 (pixelforming region 512), and is composed of a high-density impurity regionof the second conductivity type (p type in the example of theembodiment). In addition, the dark current suppression region 522 isformed in the backside of the substrate 513 (pixel forming region 512),and is composed of a p-type impurity region. The charge accumulationregion 521 is composed of an n-type impurity region. In thislight-receiving portion PD, the photodiodes are composed mainly of a p-njunction formed between the p-type impurity region constituting the darkcurrent suppression regions 522 and 523, and the n-type impurity regionconstituting the charge accumulation region 521.

In the light-receiving portion PD, the signal charges in response to theamount of incidence light are generated and accumulated. In addition,the electrons caused by generation of the dark current in the substrateinterface are absorbed in the holes which are a large number of carriersof the dark current suppression regions 522 and 523, so that the darkcurrent is suppressed.

The pixel transistors Tr are constituted by source and drain regionsformed the surface side of the substrate 513, which are not shown, andthe gate electrode 528 formed on the surface of the substrate 513through a gate insulating film 529. As described above, the pixeltransistors Tr may include three pixel transistors Tr made of a transfertransistor, a reset transistor and an amplification transistor, and inaddition, may include four pixel transistors Tr including the selectivetransistor. The source and drain regions, which are not shown, areformed by the n-type high-density impurity region formed at the surfaceside of the substrate 13, and the pixel transistors Tr according to theexample of the embodiment function as an n channel MOS transistor.

In addition, an element isolation region 524, composed of the p-typehigh-density impurity region extending from the surface of the substrate513 to the backside thereof, is formed between the pixels 2 adjacent toeach other. Each of the pixels 2 is electrically isolated by thiselement isolation region 524. Further, a light-shielding portion 517formed in a desired depth from the backside of the substrate 513 isformed in the element isolation region 524. The light-shielding portion517 is formed, for example, in a lattice shape so as to surround each ofthe pixels 2, when seen in a plan view. This light-shielding portion 517is constituted by a trench portion 519 having a desired depth which isformed the backside of the substrate 513, a high-dielectric materialfilm 518 formed in the sidewall and the bottom surface of the trenchportion 519, and a light-shielding film 520 which is buried in thetrench portion 519 through the high-dielectric material film 518. Inthis case, the utmost surface of the light-shielding film 520 buried inthe trench portion 519 is constituted in one surface with the backsideof the substrate 513. As a material of the high-dielectric material film518, for example, hafnium oxide (HfO₂), tantalum pentoxide (Ta₂O₅), andzirconium dioxide (ZrO₂) may be used. In addition, as a material of thelight-shielding film 20, for example, tungsten (W), aluminum (Al) may beused.

The interconnection layer 526 is formed in the surface side of thesubstrate 513, and includes an interconnection 525 stacked in aplurality of layers (three layers in the example of the embodiment)through an interlayer insulating film 527. The pixel transistors Trconstituting the pixel 2 are driven through the interconnection 25formed in the interconnection layer 526.

The support substrate 514 is formed in the surface opposite to the sidefacing the substrate 513 of the interconnection layer 526. This supportsubstrate 514 is constituted in order to secure the strength of thesubstrate 513 by level difference of manufacture, and is formed from,for example, a silicon substrate.

The color filter layer 515 is formed in the backside of the substrate13, and the color filter layers made of, for example, R (red), G (green)and B (blue) are formed for each pixel. In the color filter layer 515,light having a desired wavelength is transmitted, and the transmittedlight is incident on the light-receiving portion PD within the substrate513.

The on-chip lens 516 is formed in the surface opposite to the sidefacing the substrate 513 of the color filter layer 515. In the on-chiplens 516, the illuminated light is collected, and the collected light isincident on each light-receiving portion PD through the color filterlayer 515 with good efficiency.

In the solid-state imaging device 1 configured as mentioned above, thelight is illuminated from the backside of the substrate 513, and thelight which transmits the on-chip lens 516 and the color filter layer515 is photoelectric-converted by the light-receiving portion PD, sothat the signal charge is generated. The signal charge generated by thelight-receiving portion PD is output as a pixel signal by the verticalsignal line formed by the desired interconnection 525 of theinterconnection layer 526 through the pixel transistor Tr formed in thesurface side of the substrate 513.

In the solid-state imaging device 1 according the example of theembodiment, the electrons are not moved by the barrier formed due to apotential of the element isolation region 524 by the element isolationregion 524, between the pixels 2 adjacent to each other. That is, theelectrical isolation between the pixels is made due to the concentrationgradient of the impurity region formed within the substrate 513.

Further, the light which obliquely enters from the light incidence sideis prevented from being incident on the adjacent pixel 2 by thelight-shielding portion 517 buried and formed in the element isolationregion 524. That is, the optical separation between the pixels is madeby the light-shielding portion 517.

In addition, when the trench portion 519 is formed in the elementisolation region 524, there is a possibility that pinning deviation isgenerated at the peripheral portion of the trench portion 519 due to theimpurity activation caused by physical damage or ion irradiation in thesidewall and the bottom surface of the trench portion 519. With respectto this problem, in the example of the embodiment, the pinning deviationis prevented by forming the high-dielectric material film 518 havingmany fixed charges in the sidewall and the bottom surface of the trenchportion 519.

With the solid-state imaging device 1 according to the example of theembodiment, since the light-shielding portion 517 buried in the elementisolation region 524 is formed between the adjacent pixels, it ispossible to prevent the oblique light incident on the light receivingsurface from being incident on the light-receiving portion PD. Herewith,the light incident on the adjacent pixels 2 is shielded without beingcollected by the on-chip lens, and optical color mixing generatedbetween the adjacent pixels is reduced. In addition, since the lighthaving a large angle which is incident on the adjacent pixels 2 isshielded, among the diffracted light or the reflected light generatedbetween the light receiving surface and the on-chip lens 516, generationof flare is reduced.

Further, with the solid-state imaging device 1 according to the exampleof the embodiment, since the light-shielding portion 517 is configuredto be buried in the element isolation region 524, the light receivingsurface of the backside of the substrate 513 is planarized, and thecolor filter layer 515 and the on-chip lens 516 formed in the backsideof the substrate 513 approach the light receiving surface. Herewith,since the distance between the surface of the on-chip lens 516 which thelight enters and the light receiving surface of the substrate 513becomes closer, the light-collecting property is improved, and reductionin color mixing is achieved.

17.3 Manufacturing Method

FIG. 32 to FIG. 41 show a manufacturing process diagram of thesolid-state imaging device 1 of the present embodiment, and describesthe manufacturing method of the solid-state imaging device 1 of thepresent embodiment.

First, as shown in FIG. 32, a plurality of pixels 2 that includes thelight-receiving portion PD and the pixel transistor Tr is formed on thesubstrate 513. The interconnection layer 526, which is composed of aplurality of layers of interconnections 525 formed through theinterlayer insulating film 527, is formed on the surface side of thesubstrate 513. These pixels 2 and the interconnection layer 526 can beformed in a similar method to that of usual solid-state imaging device1.

In the present embodiment, for example, the substrate 513 is providedthat has the pixel forming region 512, which becomes a n-type surfaceregion of 3 μm to 5 μm thickness, and a backside region 530 under thepixel forming region 512. Then, the light-receiving portion PD, theelement isolation region 524, and the source/drain region (not shown)are formed in the pixel forming region 512 by ion implantation ofdesired impurity in a desired concentration from the surface side of thesubstrate 513. Then, the gate insulating film 529 composed of, forexample, silicon oxide film is formed on the surface of the substrate513, and then the gate electrode 528 composed of, for example,poly-silicon, is formed in a desired region on the upper side of thegate insulating film 529. The process of forming the gate electrode 528may be performed before the process of forming the light-receivingportion PD, the source/drain region and the like in the pixel formingregion 512. In this case, the light-receiving portion PD and thesource/drain region can be formed in the self-alignment using the gateelectrode 528 as a mask. Alternatively, a sidewall composed of, forexample, silicon oxide film, silicon nitride film, may be formed on thelateral side of the gate electrode 528.

In addition, the interconnection layer 526 can be formed by repeatedlyperforming the formation of the interlayer insulating film 527 composedof, for example, silicon oxide film, and the formation of theinterconnection 525 composed of aluminum, copper and the like in adesired number of times after the formation of the gate electrode 28. Atthis time, the formation of a contact portion (not shown) that connectseach interconnection to each other is also performed.

The backside region 530 is constituted in a structure where an undopedsilicon layer 530 a, an etching stopper layer 530 b composed of p-typehigh-density impurity layer and the undoped silicon layer 530 a arestacked in this sequence from the side of the pixel forming region 512.This etching stopper layer 530 b can be formed by ion implantation ofboron in high-density in a desired region of the undoped silicon layer530 a. Alternatively, a method may be used wherein the undoped siliconlayer 530 a is formed by the epitaxial growth method, and a p-typehigh-density impurity layer is formed in a desired region in the processof the formation. The backside region 530 of the present embodiment isconstituted such that the thickness of the silicon layer 530 a in theside contacting on the substrate 513 is about 2 μm to 5 μm, that of theetching stopper layer 530 b is about 1 μm, and that of the silicon layer530 a formed on the etching stopper layer 530 b is about 1 μm.

Next, as shown in FIG. 33, the support substrate 514 is anchored in theupper portion of the interconnection layer 526 by an organic adhesive orphysical bonding by plasma irradiation.

Then, as shown in FIG. 34, after the support substrate 514 is anchored,the element is inverted, and the upper surface of the backside region530 is ground by a physical grinding method. At this time, the grindingis performed to an extent so as to not reach the etching stopper layer530 b.

Next, the silicon layer 530 a of the backside region 530 is etched bywet etching using arsenous acid. Thus, as shown in FIG. 35, the etchingstops at the etching stopper layer 530 b by the difference between thedoping species of the undoped silicon layer 530 a and the etchingstopper layer 530 b composed of the p-type high-density impurity layer.That is, only the silicon layer 530 a, which is formed in the uppersurface side of the backside region 530, is etched and removed.

Next, as shown in FIG. 36, a photoresist layer 531 is formed in theupper portion of the backside region 530, and exposure and developmentare performed so as to form an aperture portion 531 a in the regionwhere the light-shielding portion 517 of the element isolation region524 is formed. In this case, since the backside region 530 is etched andremoved to the etching stopper layer 530 b in the previous processes,the surface becomes smooth. Therefore, the surface of the photoresistlayer 531 is also formed to be smooth, and thus exposure and developmentof the photoresist layer 531 are performed with a high degree ofaccuracy, which makes it possible to form a pattern of desired apertureportion 531 a with better accuracy.

Next, a trench portion 519 that reaches desired depth from the backsideof the pixel forming region 512, is formed through the backside region530 by dry-etching using the photoresist layer 531 patterned in adesired shape as a mask as shown in FIG. 37F. The depth of the trenchportion 519 may be formed in the depth as to shield the tilted lightthat is incident from the backside of the substrate 513 at the lightreceiving surface side as described above. In the present embodiment,the trench portion 519 is formed in the depth to the extent of, forexample, 500 nm to 1000 nm from the backside of the substrate 513.

Next, as shown in FIG. 38, a burying film 532 composed of a siliconoxide film (SiO₂) or a silicon nitride film (SiN) is formed to bury thetrench portion 519 using, for example, the CVD method.

Next, as shown in FIG. 39, the burying film 532 is etched by etching itat a predetermined time with wet etching. At this time, the etching isfinished in a state where the surface of the burying film 532 isprojected in about 50 to 60 nm from the backside of the substrate 513.

Next, the backside region 530 is ground by the CMP method using theburying film 532 as a stopper, and the backside region 530 is made tohave a thin wall. By this, the backside region 530 is removed as shownin FIG. 40A.

Next, the burying film 532 buried in the trench portion 519 is removedby wet etching as shown in FIG. 40B, and also the damaged layer isremoved, which is generated in the previous processes such as thegrinding process by the CMP method and the process of forming the trenchportion 519. The chemical that removes the burying film 532 ishydrofluoric acid when the burying film 532 is SiO₂, or phosphoric acidwhen the burying film 532 is SiN. The damaged layer is preferablyremoved using an alkaline chemical such as ammonia water.

Next, as shown in FIG. 41A, the high-dielectric material film 518 isformed using the CVD method or the sputter method on the backside of thesubstrate 513 including the sidewall and the bottom surface of thetrench portion 519. Subsequently, the light-shielding film 520 is formedusing the CVD method on the whole surface including the trench portion519 in which the high-dielectric material film 518 is formed, and thelight-shielding film 520 is buried in the inside of the trench portion519.

Next, as shown in FIG. 41B, the height of the light-shielding film 520is adjusted by, for example, wet etching with acid chemical such ashydrochloric acid, sulfuric acid and the like. At this time, the heightof the light-shielding film 520 is adjusted so that the surface of thelight-shielding film 520 and the backside of the substrate 513 are inthe same plane.

Then, a color filter layer 515 and the on-chip lens 516 are formed onthe backside of the substrate 513 using usual method to complete thesolid-state imaging device 1 of the present embodiment shown in FIG. 31.

As described above, the solid-state imaging device 1 of the presentembodiment can be formed by a bulk substrate. A SOI (Silicon OnInsulator) substrate is used in usual back-illuminated solid-stateimaging device, whereas it can be formed by a bulk substrate, which ischeaper in cost than the SOI substrate, in the present embodiment.Therefore, the cost is reduced as there is no use of expensive SOIsubstrate.

In addition, in the solid-state imaging device 1 of the presentembodiment, the substrate 513 is used as an example, which has thebackside region 530 where the etching stopper layer 530 b composed ofthe p-type high-density impurity layer is formed in the undoped thesilicon layer 530 a. However, the present embodiment is not limited tothis, and alternatively, a substrate can be used that has variousetching stopper layers. For example, SiC or SiGe layer may be also usedas the etching stopper layer 530 b.

In addition, the burying film 532, which is used as a stopper in theprocess of FIG. 38H, can be formed in the trench portion 19 in themanufacturing method of the solid-state imaging device 1 of the presentembodiment. Thus, thinning of the backside region 530 is made easy inthe process of FIG. 391. Then, since thinning of the backside region 530is made easy, the p-type high-density impurity layer, which is formed inthe backside region 530, can be formed to be distant to some extent fromthe light-receiving portion PD formed on the substrate 513. Therefore,modulation of the carrier profile of the light-receiving portion PD ofthe pixel forming region 512, which occurs due to the heat in thediffusion process of the p-type high-density impurity layer that is theetching stopper layer 530 b, can be suppressed.

In addition, the element isolation region 524, which is formed on thesubstrate 513, is formed by ion implantation of p-type impurity from thesurface side of the substrate 513 in the manufacturing method of thesolid-state imaging device 1 of the present embodiment. Therefore, it isdifficult for a steep potential profile to be formed in the pixelforming region 512 in the deep position from the surface side (thebackside of the substrate 513 in this case). Thus, on the backside ofthe substrate 513, there is a possibly that generated signal chargepasses through the element isolation region 524 and leaks into theadjacent pixel 2, which causes color mixing or blooming. In the presentembodiment, the light-shielding portion 517 is formed to be buried inthe element isolation region 524 in the backside of the substrate 513.Therefore, the signal charge, which leaks into the adjacent pixel, canbe physically shielded, and color mixing or blooming by transfer of thesignal charge in the substrate 513 is suppressed in a region of theelement isolation region 524 where element separating function isparticularly weak.

18. Seventeenth Embodiment

Solid-State Imaging Device

Next, a solid-state imaging device in the seventeenth embodiment of theinvention will be described. The solid-state imaging device of thepresent embodiment is a back-illuminated solid-state imaging devicesimilar to the solid-state imaging device of the sixteenth embodiment.Thus, as overall constitution is similar to that of FIG. 7, explanationwill not be repeated for the same ones.

FIG. 42 is a schematic cross-sectional configuration diagram of the mainportion of the solid-state imaging device 540 in the present embodiment.The same symbols are assigned in FIG. 42 to the parts, which correspondto those in FIG. 31, and explanation will not be repeated therefor.

As shown in FIG. 42, in the solid-state imaging device 540 of thepresent embodiment, a light-shielding portion 547 is an example where itis formed to pass through the pixel forming region 512 where thelight-receiving portion PD is formed. In the present embodiment shown inFIG. 42, the light-shielding portion 547 is an example where it isformed in the depth to reach the interconnection 525 of the first lowerlayer (the side of the substrate 513) of the interconnection layer 526.However, various constitutions are possible as long as the depth is suchone that the interconnection layer 526 is reached.

In the manufacturing method of the solid-state imaging device 540 of thepresent embodiment, the trench portion 549 is formed to pass through thesubstrate 513 in the depth to reach the interconnection 525, which isclosest to the substrate 513 out of the interconnection of theinterconnection layer 526 in the process of FIG. 37 shown in thesixteenth embodiment. Then, the light-shielding portion 547 can beformed by burying the high-dielectric material film 548 and thelight-shielding film 550 into the trench portion 549 in a similar methodto that of the solid-state imaging device 1 of the sixteenth embodiment.The materials that constitute the solid-state imaging device 540 of thepresent embodiment may be similar to those used in the sixteenthembodiment material.

In the solid-state imaging device 540 of the present embodiment, eachpixel 2, which is formed on the substrate 513, is isolated by thelight-shielding portion 547 even in a deep position from thelight-incident side, by forming the light-shielding portion 547 in thedepth to reach the interconnection layer 526. This allows moresuppressing of the incidence of the tilted light to the adjacent pixel2, and further reduces generation of flare or color mixing. In addition,each pixel 2 is isolated by the light-shielding portion 547 even in theinside of the substrate 513. Therefore, generation of blooming can bealso suppressed due to the inflow of the generated excess signal chargeto an adjacent pixel when the strong light is applied.

Furthermore, according to the solid-state imaging device 540 of thepresent embodiment, the light-shielding portion 547, which passesthrough the substrate 513 on which the light-receiving portion PD isformed, can be also used as a waveguide. That is, the incident light canbe collected by the light-receiving portion PD in the substrate 513 byreflection of the incident light by the waveguide, and thelight-collecting property is improved.

Other similar effects to those of the sixteenth embodiment are obtained.

In above-described sixteenth and seventeenth embodiments, examples havebeen described in which the present invention is applied to a CMOS typesolid-state imaging device wherein the unit pixels, which detect thesignal charges depending on the amount of the incident light as aphysical amount, are disposed in a matrix shape. However, the inventionis not limited to the application to the CMOS type solid-state imagingdevice. In addition, the invention is not limited to a general columntype solid-state imaging device in which a column circuit is disposedfor each pixel column of the pixel section in which pixels are formed inthe two-dimensional matrix shape.

For example, the solid-state imaging device of the invention may beapplied to the CCD type solid-state imaging device. In this case, thecharge transfer portion of the CCD structure is constituted on thesurface side of the substrate. Also in the case of the application tothe CCD type solid-state imaging device, similar effects can be obtainedto those of above-described sixteenth and seventeenth embodiment. Inaddition to this, incidence of the tilted light to the charge transferportion can be suppressed by the constitution of the light-shieldingportion, and thus generation of smear can be suppressed.

In addition, each pixel is mainly formed of the n-channel MOS transistorin above-described sixteenth and seventeenth embodiments. However, eachpixel may be also formed of the p-channel MOS transistor. In this case,the conductivity type is inverted in each of the figures.

In addition, the invention is not limited to the application to thesolid-state imaging device that detects the distribution of the incidentlight amount of the visible light and captures images, but may be alsoapplied to a solid-state imaging device that detects distribution of theincident amount of infrared light or X ray, or particle and the like,and captures images. In addition, in a broad sense, the invention may bealso applied to a general solid-state imaging device such as thefingerprint detection sensor that detects distribution of other physicalamounts such as pressure and electrostatic capacity and captures images(a device that detects distribution of physical amount distribution).

Furthermore, the invention is not limited a solid-state imaging devicethat scans each unit pixel of the pixel section sequentially in the rowunit, and reads pixel signal from each unit pixel. However, theinvention may be also applied to the X-Y address type solid-stateimaging device that selects any pixel in the pixel unit and readssignals from the selected pixel in the pixel unit.

In addition, the solid-state imaging device may be formed as a singlechip, and may be also formed as a module shape that has image capturingfunction with the pixel section and the signal processing portion oroptical system packaged as a whole.

In addition, the invention is not limited to the application to thesolid-state imaging device, but may be also applied to an imagingdevice. Herein, the imaging device refers to an electronic apparatusthat has image-capturing function such as a camera system, e.g., digitalstill camera or video camera, a cellular phone. In addition, the imagingdevice may be in the form of aforementioned module shape mounted to anelectronic apparatus, i.e., camera module.

19. Eighteenth Embodiment

Electronic Apparatus

Next, an electronic apparatus in the eighteenth embodiment of theinvention will be described. FIG. 43 is a schematic configurationdiagram of an electronic apparatus 200 in the eighteenth embodiment ofthe invention.

The electronic apparatus 200 of the present embodiment is an examplewhere the solid-state imaging device 1 in above-described sixteenthembodiment of the invention is a digital camera that has the function ofcapturing still image.

The electronic apparatus 200 in the present embodiment has thesolid-state imaging device 1, an optical lens 210, a shutter device 211,a drive circuit 212 and a signal processing circuit 213.

The optical lens 210 forms an image of the image light (incident light)from a photographic subject on the image capturing surface of thesolid-state imaging device 1. By this, the signal charges areaccumulated in the solid-state imaging device 1 for a certain time.

The shutter device 211 controls the light irradiation period and thelight shielding period in the solid-state imaging device 1.

The drive circuit 212 supplies drive signals that control the transferoperation of the solid-state imaging device 1 and the shutter operationof the shutter device 211. The signal transfer of the solid-stateimaging device 1 is performed by the drive signal (timing signal)supplied from the drive circuit 212. The signal processing circuit 213performs various types of the signal processing. The image signal onwhich the signal processing has been performed, is stored on a storagemedium such as memory, or output onto a monitor.

In the solid-state imaging device 1 in the electronic apparatus 200 ofthe present embodiment, generation of flare or color mixing, andblooming is suppressed, and thus the image quality is improved.

As described above, the electronic apparatus 200, to which thesolid-state imaging device 1 can be applied, is not limited to a camera,but may be applied to a digital still camera, and furthermore imagingdevice such as a camera module for a mobile device, for example, acellular phone.

The present embodiment is constituted such that the solid-state imagingdevice 1 is used in an electronic apparatus. However, the solid-stateimaging device in above-described seventeenth embodiment may be alsoused.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An imaging device comprising: a pixel region anda peripheral region disposed at an outside of the pixel region; asemiconductor substrate having a first side as a light-incident side anda second side opposite the first side; a silicon oxide film disposedabove the first side of the semiconductor substrate; a hafnium oxidefilm disposed on the silicon oxide film; a light-shielding film disposedabove the hafnium oxide film; a titanium nitride layer disposed betweenthe hafnium oxide film and the light-shielding film at the peripheralregion in a cross-section view; a plurality of photoelectric conversionregions disposed in the semiconductor substrate in the pixel region; aplurality of trench regions disposed adjacent to at least one of theplurality of photoelectric conversion regions and including a firsttrench region and a second trench region in the cross-section view; anda metallic oxide film disposed in the first trench region and the secondtrench region, wherein the metallic oxide film extends continuously fromthe first trench region to the second trench region along the first sideof the semiconductor substrate, and wherein the titanium nitride layeris disposed in contact with the light-shielding film at the peripheralregion in the cross-section view.
 2. The imaging device according toclaim 1, further comprising: a plurality of transistors, wherein atleast one transistor in the plurality of transistors is shared by atleast first and second photoelectric conversion regions in the pluralityof photoelectric conversion regions.
 3. The imaging device according toclaim 1, further comprising: an insulating layer disposed between acolor filter and the first side of the semiconductor substrate.
 4. Theimaging device according to claim 1, further comprising a planarizationlayer disposed between an on-chip color filter and the first side of thesemiconductor substrate.
 5. The imaging device according to claim 1,further comprising a transparent planarization layer, which is disposedbetween a color filter and the first side of the semiconductorsubstrate, wherein the transparent planarization layer comprises organicmaterial.
 6. The imaging device according to claim 1, furthercomprising: a plurality of transistors, wherein at least one of thetransistors in the plurality of transistors is a shared transistor, andwherein the shared transistor is a reset transistor allowing charge tobe selectively discharged from a floating diffusion to a circuit node.7. The imaging device according to claim 1, further comprising: aplurality of transistors, wherein at least one of the transistors in theplurality of transistors is a shared transistor, and wherein the sharedtransistor is an amplification transistor coupled to a floatingdiffusion such that a signal corresponding to a potential of thefloating diffusion is output to a signal line.
 8. The imaging deviceaccording to claim 7, wherein at least another one of the transistors inthe plurality of transistors is a shared transistor, and wherein theshared transistor is a select transistor that selectively enablesoperation of the amplification transistor.
 9. The imaging deviceaccording to claim 1, further comprising: a third trench region in theplurality of trench regions; a plurality of transistors, wherein thefirst trench region is a first isolation region, and wherein the thirdtrench region is disposed between the at least one of the plurality ofphotoelectric conversion regions and at least one shared transistor inthe plurality of transistors.
 10. The imaging device according to claim9, wherein the second trench region is a shallow trench isolationregion.
 11. The imaging device according to claim 1, further comprising:a plurality of transistors; a plurality of on-chip lenses disposedadjacent the first side of the semiconductor substrate; and a verticaldriving circuit, wherein the vertical driving circuit is configured todrive the plurality of transistors.
 12. The imaging device according toclaim 11, further comprising: a color filter, wherein the color filteris disposed between the plurality of on-chip lenses and the first sideof the semiconductor substrate and the color filter includes filters ofat least two different colors selected from green, red, and blue. 13.The imaging device according to claim 1, further comprising: aninsulating film disposed on the metallic oxide film, wherein thelight-shielding film is disposed on a light-incident side of theinsulating film.
 14. The imaging device according to claim 1, whereineach trench region includes a p-type impurity region.
 15. The imagingdevice according to claim 1, further comprising: a light-shieldingportion disposed between a color filter and the first side of thesemiconductor substrate.
 16. The imaging device according to claim 1,wherein the metallic oxide film is selected from the group consisting ofhafnium oxide, tantalum pentoxide, zirconium dioxide, and combinationsthereof.
 17. The imaging device according to claim 1, wherein themetallic oxide film is a high-dielectric material film.
 18. The imagingdevice according to claim 1, further comprising a plurality of isolationregions, wherein at least some of the isolation regions comprise atleast some of the trench regions in the plurality of trench regions. 19.The imaging device according to claim 1, further comprising: a microlensdisposed on a light-incident side of the metallic oxide film, wherein atleast a portion of the microlens is covered with a silicon oxide film.20. The imaging device according to claim 1, further comprising: amicrolens disposed on a light-incident side of the metallic oxide film,wherein at least a portion of the microlens is covered with a siliconoxide film.
 21. An imaging device comprising: a pixel region and aperipheral region disposed at an outside of the pixel region; asemiconductor substrate having a first side as a light-incident side anda second side opposite the first side; a silicon oxide film disposedabove the first side of the semiconductor substrate; a hafnium oxidefilm disposed on the silicon oxide film; a light-shielding film disposedabove the hafnium oxide film; a titanium nitride layer disposed betweenthe hafnium oxide film and the light-shielding film at the peripheralregion in a cross-section view; a plurality of photoelectric conversionregions disposed in the semiconductor substrate in the pixel region; aplurality of isolation regions disposed adjacent to at least one of theplurality of photoelectric conversion regions and that each include ap-type impurity region and with at least a first isolation region and asecond isolation region of the plurality of isolation regions beingdisposed between adjacent photoelectric conversion regions in thecross-section view; and a metallic oxide film disposed in the firsttrench region and the second trench region, wherein the metallic oxidefilm extends continuously from the first isolation region to the secondisolation region along the first side of the semiconductor substrate,and wherein the titanium nitride layer is disposed in contact with thelight-shielding film at the peripheral region in the cross-section view.22. The imaging device according to claim 21, further comprising: aplurality of transistors, wherein at least one transistor in theplurality of transistors is shared by at least first and secondphotoelectric conversion regions in the plurality of photoelectricconversion regions.
 23. The imaging device according to claim 21,further comprising: an insulating layer disposed between a color filterand the first side of the semiconductor substrate.
 24. The imagingdevice according to claim 21, further comprising: a light-shieldingportion disposed between a color filter and the first side of thesemiconductor substrate.
 25. The imaging device according to claim 21,further comprising: a plurality of transistors, wherein at least one ofthe transistors in the plurality of transistors is a shared transistor,and wherein the shared transistor is an amplification transistor coupledto a floating diffusion such that a signal corresponding to a potentialof the floating diffusion is output to a signal line.
 26. The imagingdevice according to claim 25, wherein at least another one of thetransistors in the plurality of transistors is a shared transistor, andwherein the shared transistor is a select transistor that selectivelyenables operation of the amplification transistor.
 27. The imagingdevice according to claim 21, further comprising: a third isolationregion in the plurality of isolation regions; and a plurality oftransistors; wherein the third isolation region is disposed between oneof the adjacent photoelectric conversion regions and at least one sharedtransistor in the plurality of transistors.
 28. The imaging deviceaccording to claim 27, wherein the third isolation region is a shallowtrench isolation region.
 29. The imaging device according to claim 21,further comprising: a plurality of on-chip lenses disposed adjacent thefirst side of the semiconductor substrate.
 30. The imaging deviceaccording to claim 29, further comprising: a color filter, wherein thecolor filter is disposed between the plurality of on-chip lenses and thefirst side of the semiconductor substrate.
 31. The imaging deviceaccording to claim 30, wherein the color filter includes filters of atleast two different colors selected from green, red, and blue.
 32. Theimaging device according to claim 21, wherein the metallic oxide film isselected from the group consisting of hafnium oxide, tantalum pentoxide,zirconium dioxide, and combinations thereof.
 33. The imaging deviceaccording to claim 21, wherein the metallic oxide film is ahigh-dielectric material film.
 34. The imaging device according to claim21, further comprising a plurality of trench regions, wherein the firstisolation region and the second isolation region each comprise a trenchregion from the plurality of trench regions.